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Package method for alleviating silic gel for large power LED

A technology for light-emitting diodes and packaging methods, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems affecting the use effect of high-power light-emitting diodes, low conversion of phosphor mixed with violet light, yellowing and decay, etc. Improve the luminous flux, improve the effect of light energy

Inactive Publication Date: 2009-10-28
王海军
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] 3. Apply RGB fluorescent powder on the (UV-LED) chip, and use purple light to excite the fluorescent powder to produce mixed light of the three primary colors, thereby forming white light. However, this technology is mainly carried out in the laboratory at present, and in actual mass production There are also problems such as low conversion of phosphor (RGB) mixed with purple light
[0009] Under the existing conditions, silica gel will have problems such as aging, yellowing and decay, which actually affect the use effect of high-power light-emitting diodes (LEDs).

Method used

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  • Package method for alleviating silic gel for large power LED
  • Package method for alleviating silic gel for large power LED

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Embodiment 1

[0023] Embodiment 1: A kind of encapsulation method of high-power light-emitting diode (LED) of the present invention reduces the need for silica gel, adopts the following process steps: the component ratio of fluorescent silica gel is calculated by the number of parts: 2 parts of phosphor powder, 8 parts of silica gel, one part is formed Fluorescent powder silicone.

[0024] The light-emitting diode LED of the present invention is composed of a packaging lens 1, a bracket 2, a fluorescent silica gel 3, a chip 4, and an AB silica gel 5.

[0025] figure 2 As shown, the package lens 1 of the present invention is made of optical glass (K9 or B270), and the light-receiving surface of the glass lens 1 is first made into a concave cavity hole, the inner hole is conical, and the outer diameter of the inner hole is 4mm , the depth is 1mm. Take 2 parts of garnet phosphor and 8 parts of AB silica gel and mix evenly to make fluorescent silica gel 3, the particle size of garnet phospho...

Embodiment 2

[0028] Embodiment 2: A kind of encapsulation method of high-power light-emitting diode (LED) of the present invention reduces the need for silica gel, adopts the following process conditions: the component ratio of fluorescent silica gel is calculated in parts by weight: 1 part of fluorescent powder, 9 parts of AB silica gel, composition One part phosphor-based silicone.

[0029] figure 2 As shown, the material of the encapsulated lens used in this example is transparent PMMA, and the light-receiving surface of the lens is made into a concave cavity hole. The inner hole is conical, the outer diameter of the inner hole is 2mm, and the depth is 0.5mm. The silicate phosphor powder and AB silica gel were uniformly prepared as fluorescent silica gel at a ratio of 1:9, the particle size of the silicate phosphor powder was 0.006mm, and the color of the phosphor powder was yellow. The coating thickness of the fluorescent silica gel is 0.4 mm, and it is stored at room temperature for...

Embodiment 3

[0030] Embodiment 3: A kind of encapsulation method of high-power light-emitting diode (LED) of the present invention reduces the need for silica gel, adopts the following process conditions: the component ratio of fluorescent silica gel is counted by weight: 3 parts of phosphor powder, AB silica gel 7, composition one Phosphor-based silica gel.

[0031] figure 1As shown, the material of the encapsulation lens used in this example is a crystal single crystal with a (SiO2) content greater than 90%. The light-receiving surface of the lens is made into a plane. The lens body is semicircular. The height is 2.3mm. Nitride phosphor powder and AB silica gel were mixed uniformly at a ratio of 3:7 to obtain fluorescent silica gel. The particle size of the nitride phosphor powder was 0.007 mm, and the color of the phosphor powder was yellow. The coating thickness of the fluorescent silica gel is 0.5 mm, and it is stored at room temperature for 2 hours in the dark and heat-proof after ...

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Abstract

The invention relates to a method for encapsulating high-power light-emitting diodes without silica gel, which is characterized in that a concave cavity hole is made on the light-receiving surface of the package lens; fluorescent silica gel is coated on the light-receiving surface of the concave cavity hole of the package lens, and then the package lens is Put it into the fixture, place the concave cavity hole upwards; press the encapsulated lens coated with fluorescent silicone into the bracket of the light-emitting diode, press the light-receiving surface of the encapsulated lens on the top of the light-emitting diode chip, and encapsulate the silicone inside the lens Extruded by the outside, the excess silica gel inside the packaging lens will be discharged; when the light-receiving surface of the concave cavity hole of the packaging lens is pressed against the light-emitting surface of the LED chip, AB silica gel is injected, and the packaging of the LED is completed after being solidified. The invention can remove or reduce the silica gel in the path of the light-emitting diode LED, so as to achieve the purpose of improving luminous flux, light energy, brightness, and reducing the external halo of light spots.

Description

technical field [0001] The invention relates to a packaging method for a high-power light-emitting diode that reduces the need for silica gel, specifically for high-power and high-brightness light-emitting diodes above 1W, and belongs to the technical field of semiconductor lighting. Background technique [0002] A light-emitting diode is a small semiconductor light-emitting device. Because a light-emitting diode is a green light source with low consumption, no harmful rays, and non-toxicity, it has begun to become a new generation of light source in the 21st century. With the The technical bottleneck of the technology is constantly being broken through, and the scope of application is getting wider and wider. [0003] At present, the main color of white light emitted by light-emitting diodes can be roughly divided into three categories, all of which must be matched with phosphors: blue light-emitting diodes with yellow phosphors; blue light-emitting diodes with red phosphor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00
Inventor 王海军
Owner 王海军