Tannic acid modified bean powder adhesion agent and method of manufacturing the same
A technology of tannic acid and adhesives, which is applied in the preparation of adhesives, animal glue or gelatin, and the type of adhesives. It can solve the problems of poor water resistance, strong corrosion, and high alkalinity of bean glue, and achieve good water resistance. Less corrosive and less alkaline effect
Inactive Publication Date: 2009-11-04
NORTHEAST FORESTRY UNIVERSITY
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- Description
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Problems solved by technology
[0003] The purpose of the present invention is to provide a tannic acid modified soybean powder adhesive and its preparation method in order to solve the problems of poor water resistance, high alkalinity and strong corrosion of the existing soybean gum
Method used
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Experimental program
Comparison scheme
Effect test
specific Embodiment approach 1
[0005] Specific Embodiment 1: In this embodiment, the tannic acid-modified soybean flour adhesive is made of 100 parts of soybean flour, 600 parts of water, and 2-14 parts of tannic acid in parts by weight.
specific Embodiment approach 2
[0006] Embodiment 2: In this embodiment, the tannic acid-modified soybean flour adhesive is made of 100 parts of soybean flour, 600 parts of water, and 4-13 parts of tannic acid in parts by weight.
specific Embodiment approach 3
[0007] Embodiment 3: In this embodiment, the tannic acid-modified soybean flour adhesive is made of 100 parts of soybean flour, 600 parts of water, and 14 parts of tannic acid in parts by weight.
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A tannic acid modified soybean powder adhesive and a preparation method thereof relate to an adhesive and a preparation method thereof. The invention solves the problems of poor water resistance, high alkalinity and strong corrosion of the existing bean gum. The product of the invention is made from 100 parts of soybean powder, 600 parts of water and 2-14 parts of tannic acid according to the ratio of parts by weight. The preparation method is as follows: dissolve soybean powder in 30-35°C water, keep warm in a 30-35°C water bath for 3-8 minutes, finally add tannic acid solution and stir until uniform, and then react at 30-35°C for 10-20 minutes. Compared with the prior art, the pH value of the adhesive in the invention is low, which reduces the irritation and corrosion to the bonded materials and production workers, reduces the production cost, and improves the bonding strength. The soybean flour adhesive produced by the invention can be used in the production of plywood and other packaging materials, has no formaldehyde release, low corrosion, good water resistance, is an environmentally friendly adhesive, has high bonding strength, is safe to use, and has a simple production process.
Description
technical field [0001] The invention relates to an adhesive and a preparation method thereof, in particular to a tannic acid modified soybean flour adhesive and a preparation method thereof. Background technique [0002] Soybean flour adhesive is a formaldehyde-free and environmentally friendly adhesive processed from defatted soybean flour. It can effectively utilize soybean processing residues, increase product added value, and increase farmers' income. Compared with the existing "aldehyde" adhesives, the wood-based panels bonded with it have no formaldehyde release during production and use, which is beneficial to environmental protection and harmless to the human body. Soybean gum was widely used in the early 20th century, but gradually declined due to the appearance of synthetic resins. In recent years, the oil crisis has intensified, prompting people to re-use renewable resources rationally and reduce dependence on petroleum products. Therefore, the research and appli...
Claims
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IPC IPC(8): C09J189/00
Inventor 王伟宏张显权庞磊谭海彦高燕明
Owner NORTHEAST FORESTRY UNIVERSITY