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Surface metal pattern orientation deposition method based on ink-jet print

A deposition method and surface metal technology, applied in the fields of information and electronics, can solve the problems of high patterning conditions of the contact method, poor direct contact between the catalyst and the substrate surface, poor system stability, etc. Fast, low consumption results

Inactive Publication Date: 2009-11-04
FUDAN UNIV
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  • Abstract
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Problems solved by technology

[0006] In order to solve the problems of weak contact between the catalyst and the surface of the substrate, high requirements for contact patterning conditions, and poor system stability, the present invention provides a positioning deposition method for metal patterning on the substrate surface. The catalyst layer template is formed on the surface of the substrate in a non-contact manner, and a tightly combined and stable deposition layer is formed

Method used

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  • Surface metal pattern orientation deposition method based on ink-jet print
  • Surface metal pattern orientation deposition method based on ink-jet print

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Embodiment Construction

[0013] Positional deposition of gold on silicon wafer surface

[0014] The catalyst used is gold sol with a particle diameter of 2.5-20nm. The preparation method of this sol is as follows: 1mL mass fraction is 1% HAuCl 4 The aqueous solution was added to 100mL ultrapure water, and 1mL of an aqueous solution of trisodium citrate with a mass fraction of 1% was added dropwise under continuous magnetic stirring; Add 1 mL of trisodium acid aqueous solution, and stir for 1 hour after completion to obtain the desired catalyst.

[0015] Modification of the silicon wafer surface: sinter the surface of a clean silicon wafer with a size of 1cm×0.5cm at high temperature or in H 2 SO 4 :H 2 o 2 Oxidation in a mixed solution with a volume ratio of 7:3 to form a silica shell, after cleaning, soak in an aqueous solution of aminopropyltrimethoxysilane (APTMS) with a mass fraction of 3 to 6% for 3 to 8 hours, after taking it out Rinse well.

[0016] Modification of office printers: Use C...

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Abstract

The invention belongs to the field of electronics and information technology, and specifically relates to a patterned positioning deposition method for surface metal based on inkjet printing. The method includes the steps of modifying the surface of the substrate, chemical deposition, etc., wherein the catalyst is patterned and distributed on the surface of the substrate by using an inkjet printer, thereby forming a patterned deposition layer consistent with the shape of the catalyst layer. The method of the invention has simple process, less consumption of catalyst, plating solution, etc., is easy to flow operation, and can greatly reduce the cost. The pattern prepared by the invention is closely combined with the matrix and is stable.

Description

technical field [0001] The invention belongs to the field of electronics and information technology, and in particular relates to a method for realizing patterned positioning deposition of metal wiring and the like on the surface of substrates such as silicon wafers and glass modified by self-assembled molecules. Background technique [0002] Metal wiring technology on the surface of semiconductors such as silicon is one of the key technologies for the development of the semiconductor industry and even the entire electronics and information industries. The original wiring technology is basically based on photolithography technology. The realization of the photolithography process needs to configure a series of sophisticated instruments and meet strict experimental conditions, so it is difficult to reduce the cost. Moreover, the processing of many metal wirings above the micron level and the specific shape patterns of metals is far from the normal application range of photol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/18C23C16/02C23C16/06
Inventor 蔡文斌王金意霍胜娟
Owner FUDAN UNIV
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