Production of planar hot pipe

Abstract

This invention discloses the manufacturing approach of a kind of flat hot tube, which includes (A) providing a shell element, the first shell and the second shell fit to form a capacity space with the first shell in shape, and the first shell have the first adjoiner, and the second shell have the second adjoiner corresponding the first adjoiner; (B) forming a adjoining layer on the second adjoiner's surface corresponding the first adjoiner in vapor deposition process; (C) and making the first adjoiner locate on the second adjoiner, making the adjoining layer melt, and making the first adjoiner and the second adjoiner compact connect to reach air tightness.

Description

technical field [0001] The invention relates to a manufacturing method of a flat heat pipe, in particular to a manufacturing method of a flat heat pipe which utilizes a vapor deposition method to make a bonding layer to increase air density. Background technique [0002] As the calculation and processing speed of electronic components such as central processing units continues to increase, the heat generation density of the electronic components also continues to increase. Therefore, in order to solve the heat dissipation problem faced by electronic components, various heat dissipation components have emerged as the times require. Generally speaking, such heat dissipation elements are nothing more than heat dissipation fins, heat dissipation fans, heat pipes, etc., or a combination of such heat dissipation elements. For example, a general heat sink guides the heat generated by high-heating components such as the central processing unit through the package surface of the comp...

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Problems solved by technology

Therefore, if a multi-element alloy material is to be used as the bonding layer 25, it is necessary to add appropriate complexing agents to the electroplating aqueous solution to adjust the reduction potentials of different metals, and it is difficult to achieve an appropriate ratio of alloy components in control.

Generally speaking, if it is a binary alloy, it can still be formed under complex control by electroplating, but its alloy composition ratio is not easy to control, and if it is a ternary or more alloy, it is difficult to form by electroplating.

[0020] At the same time, in order to meet the trend of environmental protection, binary alloys such as tin-lead are generally used as the bonding layer 25. Because of the lead contained in the alloy composition, they will gradually face elimination, and ternary alloys such as tin-silver-copper are used instead. alloy to make the bonding layer 25, and obviously, the general electroplating method is difficult to make the bonding layer 25 of the ternary alloy

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