Memory module refrigerating body

A memory module and cooling body technology, which is applied in static memory, cooling/ventilation/heating transformation, instruments, etc., can solve problems such as bending or torsion damage, strong heating of memory units, etc., achieve small flow resistance, ensure cooling, Long-lasting and effective cooling effect

Inactive Publication Date: 2007-07-25
QIMONDA
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

Due to the size of the logic IC there is the risk that especially its electrical connection terminals will be damaged by bending or twisting of the circuit board of the memory module
[0006] Furthermore, due to the very high processor speeds at which accesses are made to the memory modules, this causes the memory cells to heat up strongly during continuous operation

Method used

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  • Memory module refrigerating body
  • Memory module refrigerating body
  • Memory module refrigerating body

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Embodiment Construction

[0039] The invention is explained below on the basis of the prior art shown in FIGS. 1a and 1b.

[0040]A memory module heat sink 1 according to the prior art has a cover plate 100 ( FIG. 1 a ) and a base plate 150 ( FIG. 1 b ). In the center, the cover plate 100 has a cap-shaped groove 120 which projects over the entire width B of the cover plate 100 . That is to say, each section through the entire cover plate 100 in the longitudinal direction L shows a U-shaped section or region with short legs. The hat groove 120 is substantially rectangular, with two mutually parallel sides extending in the width direction B on the cover plate 100 . These two sides are likewise parallel to the longitudinal ends of the cover plate 100 . The side of the cap-shaped groove 120 perpendicular thereto ends by the outer edge of the cover plate 100 , while the side opposite thereto protrudes slightly beyond the side edge of the cover plate 100 .

[0041] Furthermore, the cover plate 100 and the...

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Abstract

Box has an even metal plate (100), at which the memory module is provided. The metal plate at the outer edge has a reinforcement element (110), which runs partially along the outer edge. The metal plate (100) has a central reinforcement element (120) located at a distance from the outer side (104). A thermally well conductive material, preferably a thermally well conductive elastomer and/or a (Thermal Interface Material) TIM material, is arranged between a metal plate (150) and the memory module. An independent claim is also included for the memory module radiator box mounting clip has a projection, pointing inwards in the assembly clip at a free end-section.

Description

technical field [0001] The invention relates to a memory module cooling body, especially for FB-DIMM memory modules, which is used to discharge heat generated in the memory modules to the outside. Furthermore, the invention relates to a memory module with a corresponding memory module heat sink. Background technique [0002] To actively cool the electronics in a computer, such as the memory modules, fans are often used. Such fans are installed, for example, in the walls of the computer housing and serve to cool the entire computer or parts of the computer. Especially for high-efficiency computers and computers with very large storage requirements, such as for CAD applications or for file servers, it is necessary to cool not only the usual processor and power supply, but also the memory modules. [0003] At present, memory modules in the form of SIMM (single in-line memory module), DIMM (dual in-line memory module) or RIMM (RAM bus in-line memory module) can be used. The di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367G06F1/20G11C5/00H05K7/20
CPCH01L23/4093H01L23/36H01L2924/0002G11C5/00G11C5/143G06F1/20
Inventor A·勒根S·伍德
Owner QIMONDA
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