Wave-shaped applying structure

A wave-shaped, coating technology, applied in the direction of coating non-metallic protective layers, printed circuits, instruments, etc., can solve the problems of TAB/COF lead short circuit, etc., to achieve the effect of avoiding lead short circuit, increasing the flow space and reducing accumulation
CN101013237AInactive Publication Date: 2007-08-08BOE TECH GRP CO LTD +1
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
BOE TECH GRP CO LTD
Publication Date
2007-08-08
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention relates to a wave-shaped coating structure, including the S / R coating layer coating on the TAB / COF, and the said S / R coating layer installed a number of concave parts to make the edge wave shape. The said concave part width is 1~10 lead line unit, and in the shape of rectangular, trapezoidal, U-shape or V-shape. The invention places a number of concave parts at the edge of S / R coating layer, making the S / R coating layer edge forming wave shape, and the region without coating S / R coating layer in the wave-shape edge forms a space which can exclude ACF particles when pressing, to increase the flow space of ACF particles, and reduce ACF particle packing, and ultimately avoid TAB / COF lead line short circuit.
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Description

technical field

[0001] The invention relates to a TAB / COF structure applied to LCD production, in particular to a S / R wave-shaped coating structure on the TAB / COF. Background technique

[0002] In the production process of the driver chip integrated circuit (abbreviated as TAB / COF, Tape Automated Bonding, referred to as TAB; Chip On Film, referred to as COF), the outer lead bonding (Outer Lead Bonding, referred to as OLB) method is mainly used. OLB crimping uses a certain density of conductive particles to make the COF leads and panel leads conduct longitudinal conduction (horizontal non-conduction), and the conductive particles are Anisotropic Conductive Film (ACF for short). The purpose of coating the TAB / COF with insulating solder (Solider Resistance, referred to as S / R) is to prevent the intrusion of foreign matter during the crimping process.

[0003] The S / R coating layer in the prior art is rectangular-like (as shown in FIG. 6 ), and the edge of the crimping area is ...

Claims

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