Wave-shaped applying structure

A wave-shaped, coating technology, applied in the direction of coating non-metallic protective layers, printed circuits, instruments, etc., can solve the problems of TAB/COF lead short circuit, etc., to achieve the effect of avoiding lead short circuit, increasing the flow space and reducing accumulation

Inactive Publication Date: 2007-08-08
BOE TECH GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0007] The purpose of the present invention is to provide a method that effectively solves technical defects such as ACF accumulation on the edge of the S / R coating area in the linear S / R coating structure of the prior art, which leads to short circuiting of the TAB / COF leads.

Method used

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Embodiment Construction

[0021] Fig. 1 is a schematic diagram of the wavy coating structure of the present invention. As shown in FIG. 1 , the S / R coating layer 10 is coated on the TAB / COF 100 , and the overall shape is still rectangular. The upper part of the TAB / COF is a printed circuit board and TAB / COF bonding (Bonding PCB) area 20 , and the lower part is a glass substrate and TAB / COF bonding (Bonding Cell) area 30 . The distance between the printed circuit board and the leads in the TAB / COF crimping area 20 is relatively large, about 400 μm, and there will be no accumulation of ACF particles. The distance between the glass substrate and the lead wires in the TAB / COF crimping area 30 is relatively small, about 60 μm, and ACF particles are likely to accumulate and cause short circuit of the TAB / COF lead wires. In the present invention, several recesses 40 are arranged on the edge of the S / R coating layer 10 in the area where the glass substrate and the TAB / COF are crimped, so that the edge of the ...

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Abstract

The invention relates to a wave-shaped coating structure, including the S / R coating layer coating on the TAB / COF, and the said S / R coating layer installed a number of concave parts to make the edge wave shape. The said concave part width is 1~10 lead line unit, and in the shape of rectangular, trapezoidal, U-shape or V-shape. The invention places a number of concave parts at the edge of S / R coating layer, making the S / R coating layer edge forming wave shape, and the region without coating S / R coating layer in the wave-shape edge forms a space which can exclude ACF particles when pressing, to increase the flow space of ACF particles, and reduce ACF particle packing, and ultimately avoid TAB / COF lead line short circuit.

Description

technical field [0001] The invention relates to a TAB / COF structure applied to LCD production, in particular to a S / R wave-shaped coating structure on the TAB / COF. Background technique [0002] In the production process of the driver chip integrated circuit (abbreviated as TAB / COF, Tape Automated Bonding, referred to as TAB; Chip On Film, referred to as COF), the outer lead bonding (Outer Lead Bonding, referred to as OLB) method is mainly used. OLB crimping uses a certain density of conductive particles to make the COF leads and panel leads conduct longitudinal conduction (horizontal non-conduction), and the conductive particles are Anisotropic Conductive Film (ACF for short). The purpose of coating the TAB / COF with insulating solder (Solider Resistance, referred to as S / R) is to prevent the intrusion of foreign matter during the crimping process. [0003] The S / R coating layer in the prior art is rectangular-like (as shown in FIG. 6 ), and the edge of the crimping area is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1345G02F1/1333
CPCY10T428/2457G02F1/13452H05K2201/0989H05K3/28H05K3/3452H05K3/323H05K3/361H05K1/118
Inventor 周耀东金炯昊
Owner BOE TECH GRP CO LTD
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