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Thermally conductive composition and method for preparing the same

A technology of thermal conductivity and composition, applied in the direction of chemical instruments and methods, semiconductor devices, heat exchange materials, etc., can solve the problems of reducing the effectiveness and value of heat dissipation components

Inactive Publication Date: 2007-09-12
MOMENTIVE PERFORMANCE MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These air gaps reduce the effectiveness and value of the heat sink as a heat management device

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0106] Example 1: In this example of a non-silicone / non-wax thermally conductive composition, a polyol ester in an amount of about 99% by weight is first mixed with an antioxidant in an amount of about 1% by weight to form a premix (the The premix constitutes about 8-12 wt% of the thermally conductive compound). The spherical boron nitride filler is then added to the premix in an amount of about 10-80% by weight together with high viscosity oil in an amount of about 2.5-5.5% by weight. Additionally, in one embodiment a surfactant is added in an amount of about 0.2 wt%, a polystyrene-based polymer in an amount of about 3 wt%, and a solvent in an amount of about 1 wt%. In an alternative embodiment, aluminum silicate is added in place of the polymer, solvent and surfactant in an amount of about 5.2% by weight of the compound.

[0107] Gel Examples: In the following examples, the thermally conductive composition of the present invention is in the form of a gel employing the follo...

Embodiment 2

[0117] Gel Example 2: In this example, a gel composition was prepared in the same manner as in Gel Example 1, except that Filler C-2 was used. The formulation was transferred to an injector and degassed at room temperature for a week. The resulting gel composition was cured between an aluminum coupon and a silicon coupon under 10 psi pressure at 150°C for 2 hours. The resulting sandwich structures were tested under a pressure of 30 psi. The final composition and thermal properties are listed in Table 1.

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Abstract

Thermally conductive compositions containing spherical boron nitride filler particles having an average aspect ration of less than 2.0 in a polymer matrix.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Provisional Patent Application Serial No. 60 / 603777, filed August 23, 2004, and U.S. Provisional Patent Application Serial No. 60 / 661,395, filed March 14, 2005, which are hereby incorporated in their entirety Reference. field of invention [0003] The present invention relates to a thermally conductive composition for electronic applications. Background of the invention [0004] Especially in personal computers, the removal of heat from electronic devices has become increasingly important. With increasing processing speed and miniaturization trend, the heat flux of microprocessors has increased significantly. When the temperature of the microprocessor increases, the possibility of malfunctioning of the personal computer also increases. Excess heat must be removed and the processor maintained at a certain temperature. Enhanced heat removal requires sophisticated heat treatmen...

Claims

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Application Information

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IPC IPC(8): C09K5/14C09K5/06C08K3/38H01L23/373
Inventor 钟泓萨拉·N·佩斯纳阿伦·V·高达戴维·R·埃斯勒桑迪普·S·托纳皮珍妮弗·戴维保罗·梅尼格蒂劳伦斯·马尼西亚保罗·J·汉斯罗伯特·福图纳格雷戈里·A·斯特罗萨克格雷戈里·W·谢弗霍利斯特·维克托
Owner MOMENTIVE PERFORMANCE MATERIALS INC
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