Lead-free tin-radicel soft solder

A lead-free tin-based, soft solder technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of large corrosion of copper leads and low degree of corrosion of copper leads

Inactive Publication Date: 2007-09-19
ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention will solve the problem that the lead-free solder in the known technology corrodes the copper lead too much, and provides the lead-free tin-based soft solder of the present invention for this reason. This solder has a low degree of corrosion to the copper lead and has a low cost. , characterized by high strength and good wettability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Put 40.0Kg of Sn and 10.0Kg of Cu into an alumina crucible, put it into an intermediate frequency furnace for melting, the melting temperature is 800°C, keep it warm for 2 hours, fully stir it, take it out of the furnace, and cool it to make a Sn-Cu intermediate containing 20% ​​Cu. alloy.

[0040] Put 30.0Kg of Sn and 20.0Kg of Bi into an alumina crucible, put it into an intermediate frequency furnace for melting, the melting temperature is 400°C, keep it warm for 2 hours, fully stir it, take it out of the furnace, and cool it to make a Sn-Bi intermediate containing 40% Bi alloy.

[0041] Put 48.0Kg of Sn and 2Kg of Ni into an alumina crucible, put it into a vacuum medium-frequency induction melting furnace for melting, the melting temperature is 800°C, keep it warm for 2 hours, fully stir it, take it out of the furnace, and cool it to make Sn containing 4% Ni. -Ni master alloy.

[0042] Put 49.5Kg of Sn into an alumina crucible for melting at 500°C; after the tin is...

Embodiment 2

[0046] Get Example 1 Sn-Cu master alloy 1.275Kg, Sn-Bi master alloy 0.025Kg, Sn-Ni master alloy 0.750Kg and pure tin 3.587Kg, put into a stainless steel pot for melting, the melting temperature is 600°C, and the holding time is 1 Hours, fully stirred and released from the furnace, cast on a steel electrode mold to obtain a lead-free tin-based soft solder bar.

Embodiment 3

[0048] Get Example 1 Sn-Cu master alloy 1.550Kg, Sn-Bi master alloy 0.188Kg, Sn-Ni master alloy 0.375Kg, Sn-P master alloy 0.375Kg and pure tin 3.288Kg, put into a stainless steel pot for melting, melting temperature The temperature is 600°C, the holding time is 1 hour, fully stirred, then released from the furnace, and cast on a steel electrode mold to obtain a lead-free tin-based soft solder bar.

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PUM

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Abstract

A soft solder without lead tin base with low corrosion degree, good weldability and high intensity and antioxidation during dip-soldering of the welding object, has following four items: each is composed of components of following quality percent by weight of total quality: 1.4.0-8.5% of Cu, 0.1-2.6% of Bi, 0.01-1.2% of Ni, surplus is Sn; 2.4.0-8.5% of Cu, 0.1-2.6% of Bi, 0.01-1.2% of Ni, 0.001-0.15% of P, surplus is Sn; 3.4.0-8.5% of Cu, 0.1-2.6% of Bi, 0.01-1.2% of Ni,0.001-0.3 of RE, surplus is Sn; 4.4.-8.5% of Cu, 0.1-2.6% of Bi, 0.01-1.2% of Ni, 0.001-0.3 of RE, surplus is Sn. The invention is adapted to assembling and packaging for electronic industry without lead.

Description

[0001] The invention relates to a solder alloy, especially a lead-free solder alloy, which is mainly used for lead-free assembly and packaging in the electronic industry. Background technique [0002] High-frequency transformers used in the electronics industry are wound from linear copper wires, and the lead wires at the start and end of the winding of the transformer spool need to be connected to the terminal pins and other electrodes at the lower end of the spool. The traditional connection method is to use tin-lead solder for dip soldering. However, in recent years, people have paid more and more attention to the pollution of lead to the environment and the damage to their health. Many countries have successively issued a series of laws and regulations to prevent the ecological problems caused by electronic products and limit the use of lead in electronic products. usage of. Under the general trend of lead-free green manufacturing, lead-free sealing...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 王大勇顾小龙
Owner ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL
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