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Heat-resistant bismaleimide/epoxy resin and preparation method thereof

An epoxy resin and epoxy resin curing technology, applied in the field of heat-resistant double horse/epoxy resin, can solve the problems of high brittleness, high cross-linking density, poor workmanship, etc., achieve low cost, simple operation, and improve cohesion intensity effect

Inactive Publication Date: 2007-09-19
EAST CHINA UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the general-purpose bismaleimide resin has too high cross-linking density, so it is brittle
[0006] U.S. Patent US, 3920768 (1975) discloses a kind of dibasic amine modified bismaleimide, although the dibasic amine modified bismaleimide system has good heat resistance, mechanical properties and toughness, But the manufacturability is poor, and the prepreg made has almost no viscosity

Method used

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  • Heat-resistant bismaleimide/epoxy resin and preparation method thereof
  • Heat-resistant bismaleimide/epoxy resin and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0028] The diphenylmethane bismaleimide industrial product in Example 1, impurity: ≤0.1%, melting point: 152-160 ° C, produced by Honghu Shuangma Resin Factory in Hubei Province, diaminodiphenyl sulfone is chemically pure, Purity ≥ 98.0%, melting point 189.0-191.0, produced by Sinopharm Chemical Reagent Co., Ltd.; diphenyl ether bismaleimide in Example 2 was synthesized in a laboratory, and the reference for the synthesis method: D.O.Humme, K.U.Heinen, H. Stenzenberger, and H.Siesler.Appl.Polym.Sci.18, 2015(1974); diaminodiphenylmethane is chemically pure, with a purity ≥ 98.0%, and a melting point of 120.0-121.0, produced by Sinopharm Chemical Reagent Co., Ltd.; phenolic type Epoxy resin F-51 is an industrial product with an epoxy value of 0.51, and N,N'-dimethylformamide is analytically pure with a purity ≥ 99.0%, produced by Shanghai Reagent No. 1 Factory.

[0029] Example 1

[0030] (1) Preparation of bismaleimide curing agent for chain extension o...

Embodiment 2

[0039] (1) Preparation of bismaleimide curing agent for chain extension of diaminodiphenylmethane

[0040] Add 0.02mol of diphenyl ether bismaleimide and 0.005mol of diaminodiphenylmethane (the molar ratio is 4:1) into the reactor with stirrer, thermometer and condensing device, stir Heat until the system melts, react at a temperature of 120°C±10°C for 15 minutes, and finally add 20ml of solvent N,N'-dimethylformamide to obtain reddish-brown bismaleimide with chain extension of diaminodiphenylmethane Hardener.

[0041] (2) Preparation of epoxy resin containing bismaleimide

[0042] Under heating and stirring, add 5 grams of prepolymerized curing agent and 7 grams of F-51 epoxy resin in step (1) into the reactor with stirrer, thermometer and condensing device, at a temperature of 160 ° C ± 10 ° C Next, stir the reaction for 50 minutes. After the temperature of the above mixture was lowered to room temperature, a brown solid bis-hormone / epoxy resin was obtained.

[0043] (3)...

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Abstract

The invention discloses a heat-resistant bimaleimide / epoxy resin and preparing method thereof, which includes steps: (1) adding chain expansion agent to bimaleimide, under temperature of 130-180 DEG C, reacting for 15-150 min, adding solvent and obtaining bimaleimide prepolymer; (2) mixing the bimaleimide prepolymer prepared by step (1) and epoxy resin under temperature of 120-180 DEG C, and obtaining bimaleimide / epoxy resin; (3) curing the bimaleimide / epoxy resin prepared by step (2) under temperature of 130-280 DEG C for 2-8 h, and obtaining the heat-resistant bimaleimide / epoxy resin. Advantages of the prepared bimaleimide / epoxy resin are: cohesive strength and heat endurance of the resin is enhanced, residual curing stress is reduced due to prolonged molecular chain, operation is simple, cost is low, and industrial production is convenient.

Description

technical field [0001] The invention relates to a method for preparing a heat-resistant bismaleimide / epoxy resin by adopting chain-extended bismaleimide and epoxy resin. Background technique [0002] Bismaleimide is an intermediate of addition-type polyimide, with unsaturated maleimide rings as active end groups at both ends of the molecule, and its structure can be expressed as: [0003] [0004] Where: R is CH 2 , SO 2 , O; [0005] Bismaleimide resin has excellent high temperature resistance and moisture resistance, and also has the advantages of wide source of raw materials and low cost. Since it was successfully developed by the French Rhone Poulenc company in 1969, the United States, the United Kingdom, Germany, Japan, China and other countries have carried out research and development one after another. As an ideal matrix resin for advanced composite materials, bismaleimide resin has been widely used in aerospace, mechanical electronics, transportation and othe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K5/20
Inventor 陈建定王敏蔡梦军马新胜
Owner EAST CHINA UNIV OF SCI & TECH
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