Low-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof

A no-cleaning and flux technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of polluting the environment, need to clean, strong corrosion, etc., and achieve the effect of reducing production costs and reducing process flow

Inactive Publication Date: 2007-12-12
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a low-rosin no-cleaning flux for tin-lead solder paste, which

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0030] The above preparation process is simple and easy to operate; the materials used are easy to purchase and low in cost.

[0031] After uniformly mixing 10%-20% of the flux of this embodiment and 80%-90% of tin-lead solder paste, the no-clean tin-lead solder paste is prepared.

Embodiment 1

[0033] Weigh each component according to the following mass percentages:

[0034] The active agent is 5.0%, of which DL-malic acid is 2.5%, succinic acid is 2.5%

[0035] Rosin is 12%, of which ordinary rosin is 6.0%, water white rosin is 6.0%

[0036] The film-forming substance is 2.0%, of which 301 resin is 1.0%, silicone acrylic resin is 1.0%

[0037] Surfactant selection OP--10 0.1%

[0038] Antioxidant selected benzotriazole 1.0%

[0039] Solvent (including absolute ethanol, isopropanol, etc.) balance

[0040] The sum of the contents of each component is 100%.

[0041] a. Mix the active agent with a mass percentage of 5% and the remaining solvent in a container, heat to 30°C and stir until completely dissolved;

[0042] b. Add rosin with a mass percentage of 12% into the solution mixed in step a, and keep stirring at 30°C until completely dissolved;

[0043] c. Add a surfactant with a mass percentage of 0.1% into the solution mixed in step b, and keep stirring at 30...

Embodiment 2

[0049] Each component was weighed according to the following mass percentages, and the heating temperature was controlled at 40° C. during the production process, and the others were the same as in Example 1.

[0050] The active agent is 10.0%, of which DL-malic acid is 5.0%, succinic acid is 5.0%

[0051] Rosin is 7.0%, of which ordinary rosin is 3.5%, water white rosin is 3.5%

[0052] The film-forming substance is 10.0%, of which 302 resin is 5.0%, and silicone acrylic resin is 5.0%.

[0053] Surfactant selection OP--7 1.0%

[0054] Antioxidant chooses benzotriazole 0.1%

[0055] Solvent (including absolute ethanol, diethylene glycol, glycerol, etc.) balance

[0056] The sum of the mass of each component is 100%.

[0057]The soldering flux prepared in this embodiment is a light yellow transparent viscous liquid with a pH value of 4.5-5, no halides, a non-volatile content of 28.5%, and a density of 1.16 g / ml. After uniformly mixing 15% of the flux of this embodiment and...

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Abstract

The invention relates to the colophonium and water free soldering flux is made of 5%-10% active agent, 12%-7% film forming matter, 0.1%-1% surface active agent, 0.1%-1% anti-oxidant and solution agent. It is simple in process, extensive in material resource, and low in cost. It is cleaning free, little in residue, and environment friendly.

Description

technical field [0001] The invention belongs to the technical field of surface mounting of electronic circuits, relates to a low-rosin no-clean flux used for tin-lead solder paste, and also relates to a preparation method of the low-rosin no-clean flux used for tin-lead solder paste. Background technique [0002] The solder paste used in the surface mounting process of electronic circuits is mainly composed of flux and solder powder. The flux directly affects the quality and reliability of electronic products. Its function is to eliminate the oxide film on the surface of the soldered material and the solder powder itself. Make the solder alloy diffuse rapidly and adhere to the surface of the metal being welded. At the same time, the flux for solder paste must also give the printing performance of the solder paste. According to whether the flux needs to be cleaned after soldering and the cleaning medium, the flux can be divided into three types: solvent cleaning type, water ...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 赵麦群王娅辉刘宏斌
Owner XIAN UNIV OF TECH
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