Heat-radiation type package structure and its method for making

Abstract

The invention is concerned with the thermolysis packaging structure and the making method, it is: attaches the semiconductor chip with the chip carrying piece by electricity to form the surface or the second heat sink with surface, and attaches the first heat sink with thermolysis part that is opposites the open whole of the semiconductor chip and the support part, with the chip carrying piece, next, is forms the surface or the second heat sink with surface that covers the semiconductor chip and the packaging colloid of the first heat sink, and there is must certain space leaves for the packaging colloid covering the surface, which is the way of preventing the problems of pressure damage and glue overflow of the current making method, and to the next step is incises the packaging colloid follows the surface edge and removes the unwanted, losses heat for the semiconductor chip, in order to prevent the problems of raw edge and tools wastage, which reduces the cost efficiently.

Description

technical field [0001] The invention relates to a semiconductor packaging structure and a manufacturing method thereof, in particular to a heat-dissipating semiconductor packaging structure capable of effectively dissipating heat from a semiconductor chip and a manufacturing method thereof. Background technique [0002] With the demand for thinner, lighter and smaller electronic products, semiconductor packages integrating high-density electronic components and semiconductor chips of electronic circuits have gradually become the mainstream of packaging products. However, since the semiconductor package generates high heat during operation, if the heat of the semiconductor chip is not released immediately, the accumulated heat will seriously affect the electrical function and product stability of the semiconductor chip. On the other hand, in order to prevent the internal circuit of the package from being polluted by external water and dust, the surface of the semiconductor ch...

AI Technical Summary

Problems solved by technology

[0011] However, in the manufacturing process of the aforementioned semiconductor package, during the cutting step, because the cutting tool continues to cut through the heat sink, and because the heat sink is generally made of metal materials such as copper and aluminum, when cutting with a diamond knife, Both will cause uneven sharp edges (or burrs) on the peripheral material of the heat sink to affect the appearance of the package. At the same time, it will also cause too much loss of the cutting tool, resulting in a significant increase in cost, and the production efficiency cannot be greatly improved.

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