Multi-color LED encapsulation method and its encapsulation structure
An LED packaging, multi-color technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of inability to guarantee the light consistency of phosphor light-emitting diodes, lack of manufacturing methods and products, and poor luminous color stability.
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[0038] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, in conjunction with the accompanying drawings and preferred embodiments, the specific implementation methods, The method, steps, structure, features and effects thereof are described in detail below.
[0039] Through the description of specific implementation methods, the technical means and effects of the present invention to achieve the intended purpose can be understood more deeply and specifically, but the attached drawings are only for reference and description, and are not used to explain the present invention limit.
[0040] Please refer to FIG. 1 , which is a flow chart of a preferred embodiment of the multi-color LED packaging method of the present invention. LED encapsulation method of the present invention, it mainly comprises the following steps:
[0041] (a) deploying a pigment agent in a package to form a package in which...
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