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Multi-color LED encapsulation method and its encapsulation structure

An LED packaging, multi-color technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of inability to guarantee the light consistency of phosphor light-emitting diodes, lack of manufacturing methods and products, and poor luminous color stability.

Inactive Publication Date: 2008-01-09
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in the above-mentioned existing multi-color LED packaging method and its structure, a multi-color light-emitting chip must be prepared, phosphor powder must be added in the package, and the LED must be excited to make the LED emit the light of the desired color; cost, and it is impossible to guarantee the consistency of the light color of the light-emitting diodes after the phosphor is excited each time, that is, there may be differences in the excitation effect of the phosphor due to environmental temperature, humidity and other factors, resulting in the stability of the luminous color. poor
[0011] It can be seen that the above-mentioned existing multi-color LED packaging method and its packaging structure obviously still have inconvenience and defects in the manufacturing method, product structure and use, and need to be further improved urgently.
In order to solve the problems existing in the multi-color LED packaging method and its packaging structure, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general manufacturing method and products have not been suitable. All the methods and structures can solve the above problems, which is obviously a problem that the related industry is eager to solve

Method used

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Embodiment Construction

[0038] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, in conjunction with the accompanying drawings and preferred embodiments, the specific implementation methods, The method, steps, structure, features and effects thereof are described in detail below.

[0039] Through the description of specific implementation methods, the technical means and effects of the present invention to achieve the intended purpose can be understood more deeply and specifically, but the attached drawings are only for reference and description, and are not used to explain the present invention limit.

[0040] Please refer to FIG. 1 , which is a flow chart of a preferred embodiment of the multi-color LED packaging method of the present invention. LED encapsulation method of the present invention, it mainly comprises the following steps:

[0041] (a) deploying a pigment agent in a package to form a package in which...

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Abstract

The invention is concerned with the packaging method of the multi-colored LED and the packaging structure. It is to make the prepared tincture packaging by preparing the colors into the package firstly, and to locate the white light irradiance wafer on the carrier body, next is to connect the two electrodes of the white light irradiance wafer with the pair of conductive frame electrically, and the last is to locate the tincture packaging on the top part of the white light irradiance wafer and the conductive frame for completing the packaging. The white light irradiance wafer can appear different tinctorial beam through the tincture packaging.

Description

technical field [0001] The invention relates to a multi-color LED packaging method and its packaging structure, in particular to an LED packaging method and its packaging structure which can omit the process of adding fluorescent powder and greatly reduce the defective rate of products. Background technique [0002] LED is a light-emitting diode. Its light-emitting principle is the principle of directly converting electrical energy into light energy. Generally, it uses three or five group materials (such as: Ga, In, P, etc.). A voltage is applied to the positive and negative terminals in the semiconductor. When the current passes through, the electrons and holes are combined, and the remaining energy is released in the form of light; depending on the material used, the energy level of the photon energy is generated. light of different wavelengths. The human eye can receive light of various colors, the wavelength of which is between 400-780nm, and outside this range is invis...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/62
Inventor 张正宜李美玲
Owner EVERLIGHT ELECTRONICS
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