Tannic acid modified bean powder adhesion agent and method of manufacturing the same
A technology of tannic acid and adhesives, which is applied in the preparation of adhesives, animal glue or gelatin, and the types of adhesives. It can solve the problems of high alkalinity, poor water resistance and strong corrosion of bean glue, and achieve low alkalinity, Good water resistance and low corrosion effect
Inactive Publication Date: 2008-01-23
NORTHEAST FORESTRY UNIVERSITY
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AI Technical Summary
Problems solved by technology
[0003] The purpose of the present invention is to provide a tannic acid modified soybean powder adhesive and its preparation method in order to solve the problems of poor water resistance, high alkalinity and strong corrosion of the existing soybean gum
Method used
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Experimental program
Comparison scheme
Effect test
specific Embodiment approach 1
[0005] Specific Embodiment 1: In this embodiment, the tannic acid-modified soybean flour adhesive is made of 100 parts of soybean flour, 600 parts of water, and 2-14 parts of tannic acid in parts by weight.
specific Embodiment approach 2
[0006] Embodiment 2: In this embodiment, the tannic acid-modified soybean flour adhesive is made of 100 parts of soybean flour, 600 parts of water, and 4-13 parts of tannic acid in parts by weight.
specific Embodiment approach 3
[0007] Embodiment 3: In this embodiment, the tannic acid-modified soybean flour adhesive is made of 100 parts of soybean flour, 600 parts of water, and 14 parts of tannic acid in parts by weight.
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A tannic acid modified soybean powder adhesive and the preparation method are provided, which relates to an adhesive and the preparation method. The invention solves the problems of poor water resistance, high alkaline and strong corrosion of the current soy-adhesive. Based on the weight portion, the product of the invention consists of 100 soybean powder, 600 water and 2 to 14 tannic acid. The preparation method is as follows: the soybean powder is dissolved in the water of 30 DEG C. to 35 DEG C. and insulated in the water for 3min to 8min, and is added with tannic acid solution to react for 10min to 20min under the temperature of 30 DEG C. to 35 DEG C. after stirring evenly. Compared with the prior art, the invention has the adhesive with low pH value, reduces the stimulation and corrosion on the bonded materials and the production workers and the production cost and increases the bonding strength. The soybean powder adhesive manufactured by the invention can be used for the production of the plywood and other packing materials and has no formaldehyde releasing, low corrosion and good water resistance, which belongs to the environmental adhesive with high bonding strength, safe use and simple production technology.
Description
technical field [0001] The invention relates to an adhesive and a preparation method thereof, in particular to a tannic acid modified soybean flour adhesive and a preparation method thereof. Background technique [0002] Soybean flour adhesive is a formaldehyde-free and environmentally friendly adhesive processed from defatted soybean flour. It can effectively utilize soybean processing residues, increase product added value, and increase farmers' income. Compared with the existing "aldehyde" adhesives, the wood-based panels bonded with it have no formaldehyde release during production and use, which is beneficial to environmental protection and harmless to the human body. Soybean gum was widely used in the early 20th century, but gradually declined due to the appearance of synthetic resins. In recent years, the oil crisis has intensified, prompting people to re-use renewable resources rationally and reduce dependence on petroleum products. Therefore, the research and appli...
Claims
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IPC IPC(8): C09J189/00
Inventor 王伟宏张显权庞磊谭海彦高燕明
Owner NORTHEAST FORESTRY UNIVERSITY
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