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Silicon-containing curable composition and its cured product

A curable composition and compound technology, which is applied in the field of cured products, can solve the problem of heat resistance, alkali resistance, crack resistance, and gas release components, which cannot fully satisfy heat resistance, crack resistance, and crack resistance and alkali resistance. High heat resistance, less ingredients, excellent transparency

Active Publication Date: 2008-01-23
ADEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, although the technologies proposed in these documents each have their own characteristics, none of them can simultaneously satisfy the so-called high heat resistance, alkali resistance, crack resistance, and gas release components required for materials in the latest electronic information field. minimal performance
[0005] For example, the material proposed in Patent Document 1 cannot fully satisfy heat resistance, crack resistance, especially alkali resistance; in addition, the material proposed in Patent Document 2 cannot fully satisfy alkali resistance; in addition, the material proposed in Patent Document 3 Crack resistance, especially alkali resistance, cannot be fully satisfied

Method used

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Examples

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Embodiment

[0079] Hereinafter, although an Example demonstrates this invention in more detail, this invention is not limited to these Examples. In addition, "part" and "%" in an Example are a unit based on mass.

Synthetic example 1

[0080] [Synthesis Example 1] Component (A): Synthesis of Prepolymer-1

[0081] Add 100 parts of 1,3,5,7-tetramethylcyclotetrasiloxane, 100 parts of 1,4-bis(dimethylvinylsilyl)benzene, 60 parts of toluene and 0.0005 parts of platinum-carbonylvinyl The methyl complex (Ossko catalyst) was refluxed for 5 hours while stirring. The solvent was distilled off from the reaction solution under reduced pressure at 70° C. to obtain Prepolymer-1 as the (A) component.

[0082] The result of GPC analysis is: the molecular weight Mw=3000 of prepolymer-1, by 1 According to H-NMR, the content of the hydrosilyl group (Si—H group) was 5.3 mmol / g.

Synthetic example 2

[0083] [Synthesis Example 2] Component (A): Synthesis of Prepolymer-2

[0084] [Precursor] Synthesis of 1,5-divinyl-1,1,5,5,-tetramethyl-3,3-diphenyltrisiloxane

[0085] First, 1,5-divinyl-1,1,5,5,-tetramethyl-3,3-diphenyltrisiloxane was synthesized as the precursor of prepolymer-2. That is, 100 parts of diphenylsilanediol was dispersed in 450 parts of toluene, and 120 parts of pyridine was added and stirred. 170 parts of vinyl dimethyl chlorosilane was added to this suspension, and after reacting at 50 degreeC for 2 hours, ion-exchange water was added and reaction was terminated.

[0086] The water layer was removed from the reaction solution, and the solvent was distilled off to obtain a silicon-containing divinyl compound (1,5-divinyl-1,1,5,5,-tetramethyl-3,3-diphenyl trisiloxane).

[0087] Utilize the result of GC-MS analysis: the molecular weight Mw=384 of above-mentioned silicon-containing divinyl compound, by 1 The vinyl content obtained by H-NMR was 4.99 mmol / g.

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Abstract

A silicon-containing curable composition, comprising: a prepolymer (A) containing two or more Si-H groups per molecule obtained by hydrosilylation reaction of one kind or more selected from each of components (±) and components (²) described below; a cyclic siloxane compound (B) containing per molecule two or more carbon-carbon double bonds that have reactivity to the Si-H groups; and a hydrosilylation catalyst (C); wherein the component (±) is a cyclic siloxane compound represented by formula (1) and contains two or more Si-H groups per molecule, wherein R 1 , R 2 and R 3 each are an alkyl group having 1 to 6 carbon atoms or a phenyl group, may be the same or different, a is any number of 2 to 10, b is any number of 0 to 8, and a+b ‰¥ 2, and wherein the component (²) is a compound containing per molecule two or more carbon-carbon double bonds that have reactivity to the Si-H groups.

Description

technical field [0001] The present invention relates to a silicon-containing curable composition and a cured product obtained by curing the composition. More specifically, it relates to a silicon-containing curable composition usable as an electric or electronic material and a cured product thereof. Background technique [0002] Various studies have been conducted on silicon-containing compounds, and polysiloxane compounds represented by silicone resins, for example, have been used industrially for a long time. However, although silicone resins are excellent in heat resistance and flexibility, they are limited in use due to contamination problems in electronic component manufacturing processes and the like because they contain many gas-releasing components (volatile components). [0003] In addition, in recent years, with the development of the electronic information field, high performance is also required, so research is being carried out to produce the properties that ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/14C08G77/50
CPCC08G77/52C08G77/20C08G77/70C08L83/14C08L83/04C08K5/56C08G77/12C08G77/045C08L83/00C08L2666/52C08G77/50
Inventor 尾见仁一坂卷功一森田博斋藤雅子
Owner ADEKA CORP
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