Temperature-sensing device structure of electromagnetic heater

A technology of temperature sensor and induction cooker, applied in the field of induction cooker, can solve the problems of temperature increase, easy to burn out the wire plate under the microcrystalline plate, inability to accurately detect the heating temperature of the pot body, etc. burnout effect

Inactive Publication Date: 2008-01-30
胡述斌
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Problems solved by technology

[0002] The induction cooker uses the principle of electromagnetic induction to generate eddy currents to heat cooking pots. The contact surface between the induction cooker and the pot is usually designed to be flat. Since the temperature sensor is under the microcrystalline plate, it cannot accurately detect the heating temperature of the pot body. It plays the role of ove

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  • Temperature-sensing device structure of electromagnetic heater

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[0008] The present invention will be further described below in conjunction with a preferred embodiment and its accompanying drawings. See Figure 1 The preferred embodiment of the present invention is to open a circular groove (2) in the center of the microcrystalline plate (4), and Drill two small holes (5) in the slot (2), put the thermistor (3) into the groove (2), and lead out the two feet of the thermistor (3) through the small holes (5). Use one The round copper plate (1) is inserted into the round groove (2) and glued firmly to prevent water from entering, so that the surface of the copper plate (1) and the microcrystalline plate (4) are level, the copper plate (1) and the thermistor (3) The temperature sensor is composed, and the copper plate (1) plays a role of heat conduction. The bottom of the stainless steel pot is in close contact with the copper plate (1) during work, which can accurately control the temperature in the pot, so as to realize the intelligent control of...

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Abstract

A temperature sensing implement structure of an electromagnetic stove comprises a crystallite board, a thermal resistance, etc. The invention is characterized in that: the copper board and the thermal resistance constitute a temperature sensing implement which can closely contact with a stainless steel boiler to precisely detect the temperature in the boiler, an insulation layer is additionally arranged between the crystallite board and a wire disk. The invention has the beneficial effects that: because the temperature sensing implement closely contacts with the bottom of the stainless steel boiler, the temperature control is very precise, so the intelligent control of the frying dishes without soot and cooking rice are achieved, because the existing electromagnetic stove can not precisely detect the temperature in the boiler, the functions can not achieved; because the insulation layer is additionally arranged between the crystallite board and the wire disk, the heat on the crystallite board is prevented from transferring to the body, the temperature in the electromagnetic stove body is effectively reduced, and at the same time the burnout of the wire disk is prevented.

Description

Technical field: [0001] The invention relates to the technical field of an electromagnetic cooker, in particular to a temperature sensor structure of an electromagnetic cooker. Background technique: [0002] The induction cooker uses the principle of electromagnetic induction to generate eddy currents to heat cooking pots. The contact surface between the induction cooker and the pot is usually designed to be flat. Since the temperature sensor is below the microcrystalline plate, it cannot accurately detect the heating temperature of the pot body. Play the role of over-temperature protection (anti-dry burning); when the induction cooker is working, especially when the "barbecue" function is used, the temperature of the stainless steel pot and the microcrystalline plate is above 300 ° C, which is not only easy to burn out the bottom of the microcrystalline plate The wire reel also greatly increases the temperature inside the body. Invention content: [0003] The object of t...

Claims

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Application Information

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IPC IPC(8): G01K1/14G01K7/22F24C7/08H05B6/00
Inventor 胡述斌
Owner 胡述斌
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