A making method for white LED chip

A white light-emitting and light-emitting chip technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems that the packaging solution is difficult to meet the requirements, the chip cannot be coated with phosphor powder, and the glue is difficult to withstand high temperature.

Active Publication Date: 2008-03-26
GUANGDONG REAL FAITH LIGHTING TECH
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Problems solved by technology

However, this method also cannot ensure that the side of the chip is evenly coated with phosphor; at the same time, because it is difficult to ensure gap-free bonding between the light-emitting chip and the film, the light will be reflected and refracted multiple times on the interface that is not completely bonded. , resulting in a decrease in light extraction efficiency; and because each light-emitting chip has to be pasted with a cured film, the pr...

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  • A making method for white LED chip
  • A making method for white LED chip

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Embodiment 1

[0016] Embodiments of the present invention are further described below in conjunction with the accompanying drawings:

[0017] Referring to Fig. 1a and Fig. 1b, GaN blue LED chips 13 and electrodes 12 formed in an array on a silicon wafer substrate 11; referring to Fig. 2a and 2b, YAG yellow phosphor 22 is doped in a transparent glass substrate 21; 3a, FIG. 3b, YAG yellow phosphor powder 22 is deposited on the surface of the transparent substrate 21 by evaporation deposition or suspension coating process.

[0018] See Figure 4 and Figure 5 for the manufacturing process of white LED chips. The specific steps are as follows:

[0019] A. GaN blue light-emitting chips 13 and electrodes 12 are fabricated into an array on the silicon wafer substrate 11 by multi-layer epitaxy and photolithography, etching, and flip-chip methods;

[0020] B. Add aluminum yttrium garnet (YAG) yellow fluorescent powder 22 into the borosilicate glass raw material, mix it evenly, sinter and shape it, an...

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Abstract

This invention relates to a preparing method for white LED chips with a monochromatic light-emitting chip, a lead, a base chip with fluorescent powder and a wafer base board characterizing that a wafer bonded technology is applied to the chip with fluorescent powder and the wafer base board to bond them to be cut to get LED chip generating white light, and the bonded technology includes an anode bonding, adhesive bonding and low temperature surface activated bonding.

Description

technical field [0001] The invention relates to a method for manufacturing a semiconductor device, in particular to a method for preparing a white light-emitting diode (LED) chip. technical background [0002] Existing high-brightness white light-emitting diodes (LEDs) are formed by mixing different colors of light. For example, red, green, and blue chips are combined to form white light through optical lenses, or purple or ultraviolet light is used to excite red, green and blue (RGB) phosphors to obtain white light, or blue light is used to excite yellow phosphors to obtain white light. Among them, the blue LED chip plus YAG yellow phosphor is used to produce white light. The YAG yellow phosphor is mixed into epoxy resin or silica gel, mixed evenly, and coated on the blue chip by coating or dispensing. The disadvantage of this method is that if the coating dose of the yellow phosphor is not accurately controlled during the packaging process, or conformal coating cannot be ...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L21/50
Inventor 刘胜陈明祥罗小兵甘志银
Owner GUANGDONG REAL FAITH LIGHTING TECH
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