Method for multi-layer flexible printed circuit board vacuum laminating photosensory membrane and its fake attaching tools
A flexible printing and photosensitive film technology, which is applied in the manufacture of multilayer circuits and the removal of conductive materials by chemical/electrolytic methods. rate, overcome the effect of gravity, and improve the effect of manufacturing efficiency
Active Publication Date: 2008-04-02
靖江市城中村投资建设有限公司
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Problems solved by technology
If the photosensitive film is forcibly pre-attached to the surface of the circuit pattern of the copper clad laminate, the air bubbles in the steps will be sealed, and the air will not be able to be cleaned when vacuuming, and there will be many air bubbles in the product, which will lose the effect of vacuuming. When etching the circuit, The etchant will invade from the formed air bubbles, causing the orifice plate to be disconnected from the circuit. This kind of disconnected defective product is relatively common in the production process of multi-layer FPC. Moreover, the above-mentioned single-sided vacuum lamination method is inefficient, and each batch of products Calculated on 96 sheets, the time to produce a batch of products is as long as 240 minutes, and the double-sided vacuum lamination photosensitive film is directly used to improve efficiency. The photosensitive film attached to the lower surface of the multi-layer FPC is easy to fall under the action of gravity Difficult to flatten and still form bubbles that cannot be eliminated when vacuuming
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[0044] A method for double-sided vacuum lamination of photosensitive film on four-layer FPC by using a false bonding tool, which has the following steps in sequence:
[0045] Preheat the table → separate the photosensitive film → falsely attach the photosensitive film → vacuumize the lamination chamber → press.
[0046] Preheating the table: As shown in Figure 1, the upper and lower tables 1 and 3 of the vacuum laminator are respectively paved with OPP separation film 2, and preheated to a set temperature of 100°C;
[0047] Separating the photosensitive film: separating the photosensitive layer 5 of the photosensitive film shown in Figure 2 from the polyethylene protective layer 7 on its surface, exposing the photosensitive layer 5 intended to be attached to the circuit pattern surface of the upper and lower copper-clad boards of the four-layer FPC 6 spare. The thickness of the photosensitive layer 5 is 40 μm, which is 20 μm greater than the height of the hole plate.
[0048...
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Abstract
The invention discloses a method of multi-layer flexible printed circuit board double-sided vacuum laminating photosensitive layer, which is characterized in that a procedure of pseudo-attaching a photosensitive layer is disposed before a procedure of a lamination chamber extracting vacuum. Pseudo-attaching tool is utilized to pseudo-attach spare photosensitive layer which is sustained by a vector layer to the surface of circuit graph of the upper and lower copper clad laminate of multi-layer FPC. If the position of pseudo-attaching appears deviation, it will be unloaded by the photosensitive layer sustained by the vector layer in a short time and pseudo-attached again. The method can reduce produce the steps of multi-layer FPC and improve manufacturing efficiency evidently. The invention also discloses a pseudo-attaching tool for implementing the method of the invention, of which the body is a rigid handle and the head is a flexible attaching head. The tool with the advantage of simple instrument and convenient utility can pseudo-attach the photosensitive layer which can't drop by conquering gravity to the surface of circuit graph of the upper and lower copper clad laminate of multi-layer FPC smoothly, and implacable bubbles will not be formed when vacuum is extracted, which reduce the rate of unqualified product of raw product obviously of multi-layer PFC in the process of the vacuum lamination.
Description
technical field [0001] The invention relates to surface treatment of printed circuit boards, in particular to a method for double-sided vacuum lamination of photosensitive films on multilayer flexible printed circuit boards and a dummy bonding tool. Background technique [0002] Multilayer flexible printed circuit board (Flexible Printed Circuit board, referred to as FPC) is suitable for more complex circuits. It is formed by lamination and bonding of at least three layers of conductive pattern layers and prepreg, that is, insulating material layers, requiring specified interlayer conductive pattern interconnection. The commonly used typical process is pattern electroplating, also known as "hole plating". After the circuit board is drilled, the inner wall of the hole will be plated with copper to make it a via, and the wires connected to the different layers of the via will be connected. This method is the outer layer of copper clad laminates (Copper Clad Laminates, abbrevi...
Claims
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Login to View More IPC IPC(8): H05K3/06H05K3/46
Inventor 丁澄韩垂华
Owner 靖江市城中村投资建设有限公司