Pyroelectric material of in situ nanometer composite Mg-Si-Sn basis and preparation method thereof
A nano-composite, thermoelectric material technology, applied in the direction of thermoelectric device junction lead-out material, thermoelectric device manufacturing/processing, etc., can solve the problems affecting the electrical properties of materials, interface pollution, and inability to effectively improve thermoelectric properties, etc., to reduce Interfacial contamination, improving thermoelectric performance, and reducing the effect of thermal conductivity
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Embodiment 1
[0018] Raw materials are stoichiometrically compared to Mg 2 Si 0.48 sn 0.52 After calculation and weighing, put it in a ceramic tube protected by Ar gas, heat it in a furnace at 1100°C and fully melt it, then quickly move the ceramic tube to a furnace at 860°C, and then cool it to 780°C at a cooling rate of 1°C / min. Annealed at 600°C for 100h, then mechanically ball-milled the material, then hot-pressed in vacuum at 650°C and 80MPa for 2h. In situ nanocomposite Mg-Si-Sn based thermoelectric materials were obtained.
[0019] RigakuD / MAX-2550PC X-ray polycrystalline diffractometer (XRD) was used to analyze the phase of the sample prepared in this example, and the sample was obtained as a composite material of Si-rich phase and Sn-rich phase.
[0020] The microstructure of the material was observed by FEI Sirion Field Emission Scanning Electron Microscope (FESEM), and the dispersed Si-rich nanoparticles were obtained with a diameter of 100nm. The Si:Sn atomic content ratio w...
Embodiment 2
[0023] Raw materials are stoichiometrically compared to Mg 1.998 La 0.002 Si 0.40 sn 0.60 After calculation and weighing, put it in a ceramic tube protected by Ar gas, heat it in a furnace at 1200°C and fully melt it, then quickly move the ceramic tube to a furnace at 900°C, and then cool it to 780°C at a cooling rate of 1°C / min. Annealed at 600°C for 150h, then mechanically ball-milled the material, and then vacuum hot-pressed at 650°C and 80MPa for 1h. Microstructure observation shows that the sample is a composite material of Si-rich phase and Sn-rich phase. Silicon-rich phase particles are evenly dispersed on the tin-rich substrate with a particle size of 80nm. XRD and energy spectrum analysis show that the Si:Sn atomic content ratio of the Sn-rich phase is 0.33:0.67, and the Si-rich phase Si:Sn atomic content ratio is 0.80: 0.20. The performance test shows that the thermal conductivity of the nanocomposite thermoelectric material is κ=1.9W·m at room temperature -1 K...
Embodiment 3
[0025] Raw materials are stoichiometrically compared to Mg 1.99 La 0.01 Si 0.30 sn 0.70 After calculation and weighing, put it in a ceramic tube protected by Ar gas, heat it in a furnace at 1150 °C and fully melt it, then quickly move the ceramic tube to a furnace at 900 °C, and then cool it to 780 °C at a cooling rate of 1 °C / min. Then anneal at 600°C for 100h, and then mechanically ball mill the material, then vacuum hot press at 600°C and 80MPa for 2h. Microstructure observation shows that the sample is particles of silicon-rich phase dispersed on a tin-rich phase substrate with a particle size of 50nm. XRD and energy spectrum analysis show that the Sn-rich phase Si:Sn atomic content ratio is 0.25:0.75, and the Si-rich phase Si: The Sn atomic content ratio is 0.75:0.25. The performance test shows that the thermal conductivity of the composite thermoelectric material is κ=2.0W·m at room temperature -1 K -1 , the Z value is 960×10 at 800K -6 K -1 .
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