Vacuum super thermal conduction heat radiator

Abstract

The invention relates to a vacuum super thermal conductivity radiator, which is applied in thermal conjugations such as a CPU and the like on a machine plate in a computer to radiate heat energy and comprises a rectangular fin module group, a heat conduction module group and a exhaust fan which are thermal-conjugated with the CPU, wherein at least one vacuum super thermal conductivity pipe is used to connect the rectangular fin module group and the heat conduction module group to form stereo frame group morphology configuration and rapid heat energy transmission by a superconducting heat pipe, a shielding case is arranged on a terminal protruding point which connects the rectangular fin module group and the super thermal conductivity pipe to rapidly radiate the heat energy, which is beneficial for manufacturing by combining the superconducting heat pipe and the rectangular fin module group, and ventilating currents are brought away on the rectangular fin module group and the heat conduction module group to radiate through the exhaust fan which is arranged on the rectangular fin module group, which improves the problems of the heat transmitting performance, the time for combining components, the cost, the thermal spread efficiency and the like.

Description

technical field [0001] The invention relates to a heat dissipation device, especially a vacuum superconducting heat sink with superconducting heat pipes that can be configured remotely to form high heat transfer and heat dissipation efficiency, so as to adapt to the interior of the computer case, or to connect the outer space with electronic components. (such as CPU, etc.) Thermal bonding heat dissipation. Background technique [0002] At present, the electronic components in the computer and its peripheral equipment use heat sinks to dissipate the high heat generated by the electronic components during operation. The heat dissipation area and heat transfer structure design of the heat sink will directly reflect its heat transfer and Heat dissipation efficiency, so a good structure and design will improve heat dissipation efficiency and quality. [0003] Known heat dissipation devices applied to electronic components, the typical structure includes a plurality of monolithic...

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Problems solved by technology

[0005] 1. The heat pipe that connects and transfers heat energy between the heat conduction plate and the fin module is a heat transfer pipe generally composed of capillary tissue and a single heat transfer liquid. It has the characteristic that the internal heat transfer liquid must reflow to drive heat transfer again. Therefore, the heat transfer efficiency is limited, and it cannot meet the requirements of long-distance configuration.

[0006] 2. The combination of the above-mentioned fin module and the heat pipe, the end of the heat pipe is extended and partially exposed outside the last heat dissipation fin of the fin module, and the end of the heat pipe is mostly a sealed end with a reduced diameter head, so that the heat transferred by the heat pipe is easy to concentrate on the exposed sealing end, and it cannot be quickly dispersed and diverged, which affects the heat dissipation efficiency

[0007] 3. The combination of the fin module and the heat pipe, due to the actual implementation of the combination of multiple heat pipes and the fin module, in other words, multiple heat pipes must be aligned one by one in the process of combining with the fin module Each heat pipe makes it form a flat state with the fin module to facilitate the overall tight integration. The alignment process is time-consuming and labor-intensive, and the processing cost is high and the production capacity is also affected.

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