Wastewater treatment system and method
A wastewater treatment system and technology for wastewater treatment, applied in water/sewage treatment, natural water treatment, chemical instruments and methods, etc., can solve problems such as high cost, complex systems and processes, and a large amount of chemicals, so as to prolong the service life , the structure is simple, the effect of reducing cost
Inactive Publication Date: 2008-08-20
SEMICON MFG INT (SHANGHAI) CORP +1
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[0004] The above wastewater treatment method uses a multi-step chemical method to treat the wastewater from semiconductor manufacturing and packaging, which requires a large amount of chemicals, the system and process are complicated, and the cost is high
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[0029] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0030] Before the semiconductor chips are packaged, the backside of the semiconductor wafer needs to be thinned and the semiconductor chips are cut from the semiconductor wafer, and then single or several semiconductor chips are packaged, wired and tested. The backside thinning process is a process of removing part of the silicon material on the backside of a semiconductor wafer by grinding equipment. For example, for a 300mm semiconductor wafer, its thickness is generally 700 to 800mm, and it usually needs to be thinned to 200 to 400mm before packaging; cutting process The semiconductor chips are cut from the semiconductor wafer by a dicing saw using a diamond blade. A large amount of wastewater containing suspended silicon is produced in both grinding and cutting processes. The present invention provides a treatment system for the waste w...
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Abstract
The invention relates to a wastewater treatment system used for wafer milling and dicing in semiconductor package craft, comprising a collecting groove, a physical filtering device and a receiving device. The invention is characterized in that the collecting groove is used to collect the wastewater used for milling and dicing in semiconductor package craft; the physical filtering device is used to separate the suspended substance from the wastewater by physical filtration; the physical filtering device is fluidly connected with the collecting groove; the receiving device is used to receive the wastewater processed by the physical filtering device; the receiving device is fluidly connected with the physical filtering device; the invention also discloses a wastewater treatment method for the wastewater used by milling and dicing in semiconductor package craft as well. The wastewater treatment system simplifies the treatment process of wastewater used by milling and dicing in semiconductor package craft, and reduces the cost.
Description
technical field [0001] The invention relates to the technical field of semiconductor packaging and testing, in particular to a waste water treatment system and method for grinding and scribing in a semiconductor packaging and testing process. Background technique [0002] In semiconductor manufacturing technology, semiconductor chips with various functions are formed through a series of lithography, etching, deposition, ion implantation, grinding, cleaning and other processes, and then the semiconductor chips are packaged and electrically tested, and finally form the end product. For cost and mass production reasons, semiconductor chips are typically fabricated on silicon-based semiconductor wafers. At present, the diameter of semiconductor wafers is generally 200 or 300 mm. Before encapsulation, the thickness of the semiconductor wafer needs to be reduced by grinding; then each semiconductor chip is cut from the semiconductor wafer by dicing. A large amount of industrial...
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IPC IPC(8): C02F1/00B01D36/00
CPCB01D36/02B01D37/00B01D43/00C02F1/444C02F2103/346
Inventor 林信才彭云新刘江冯均
Owner SEMICON MFG INT (SHANGHAI) CORP