Conductance compound material and preparing process
A conductive composite material and preparation process technology, which is applied to conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc. Simple preparation process, high strength and density, and a wide range of effects
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Embodiment 1
[0017] Material composition: graphite 89wt%, epoxy resin 8wt%, phenolic resin 3wt%; mixed and ground by ball mill, particle size is 100 mesh to 180 mesh; put into mold and hot press, molding pressure: 30MPa, molding temperature: 250℃, curing Time: 100min.
[0018] The properties of the prepared conductive composite material are as follows:
[0019] Bending strength: 45.6MPa; electrical conductivity: 285S / cm.
Embodiment 2
[0021] Material composition: graphite 85wt%, epoxy resin 0wt%, phenolic resin 15wt%; use ball mill to mix and grind, the particle size is 100 mesh to 160 mesh; put it into the mold for hot pressing, molding pressure: 40MPa, molding temperature: 260°C, curing Time: 90 minutes.
[0022] The properties of the prepared conductive composite material are as follows:
[0023] Bending strength: 61.6MPa; electrical conductivity: 142S / cm.
Embodiment 3
[0025] Material composition: graphite 83wt%, epoxy resin 12.5wt%, phenolic resin 4.5wt%; mixed and ground by ball mill, particle size is 100 mesh to 180 mesh; put into mold and hot press, molding pressure: 30MPa, molding temperature: 250℃ , Curing time: 100min.
[0026] The properties of the prepared conductive composite material are as follows:
[0027] Bending strength: 56MPa; electrical conductivity: 162S / cm.
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