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Bendable organic small molecule touch sensor array and method for making same

A tactile sensor, small molecule technology, applied in the field of sensors, can solve the problems of difficulty, heavy weight, and large volume.

Inactive Publication Date: 2008-09-10
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of these components are relatively large in size and weight, and it is not easy to form a flexible large-area and multi-unit array composed of micro-components, and it is not easy to form a "tactile" measurement condition like a finger.

Method used

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  • Bendable organic small molecule touch sensor array and method for making same
  • Bendable organic small molecule touch sensor array and method for making same
  • Bendable organic small molecule touch sensor array and method for making same

Examples

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Embodiment Construction

[0019] Take the polyimide substrate on which the ITO thin film has been deposited, and the stripe width of the ITO used as the second electrode (anode) is 0.5 mm. Prepare the Alq thin film that thickness is 100nm by vacuum evaporation, and each Alq spot is the circle of diameter 0.707mm, then on Alq, evaporate the Al metal stripe that width is 0.5mm, form the first electrode (cathode), thus just prepare The unit size is 1×1mm 2 The sensor dot matrix forms a 20×40 pressure sensor array. On the prepared pressure sensor array, cover Figure 4 As shown, there is rubber with a thickness of 0.5-2 mm with protrusions, and the protrusions are aligned with the pressure unit, and then the device is encapsulated with epoxy resin and ultraviolet or heating methods. The encapsulation process is carried out in an anhydrous and oxygen-free high-purity inert environment. After packaging, the pressure sensor array can be connected to a special external analysis circuit, and the pressure tes...

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Abstract

The invention belongs to the sensor technical field, in particular to a bendable organic small molecular touch sensor array and a preparation method thereof. The sensitive material of the sensor array is made of organic conjugated small molecular semiconductor material and the structure of the sensor array, from bottom to top, are sequentially a bendable substrate, a second electrode, an organic material layer, a first electrode and a rubber substrate; wherein, the electrode bars of the first electrode and the second electrode are crossly and vertically arranged in longitudinal and transverse direction and form the sensing array with the organic material layer. The preparation of the sensor array can adopt a vacuum vapor plating method or an ink-jet printing method. The pressure sensor array is characterized by high sensitiveness, small volume, light weight, low cost, being bendable, etc., can be used for pressure sensing and tough sensing of medical or household robot fingers and the pressure sensor array related to the industrial automation control.

Description

technical field [0001] The invention belongs to the technical field of sensors, and in particular relates to a bendable organic small molecule pressure sensor array and a preparation method thereof. Background technique [0002] At present, the commonly used tactile or pressure sensors include strain gauge pressure sensors, ceramic pressure sensors, diffused silicon pressure sensors, piezoelectric pressure sensors, and semiconductor (such as amorphous silicon, polysilicon, etc.) pressure sensors, as well as conductive rubber pressure sensors doped with carbon black. sensors, or carbon nanotube-containing, micromechanical pressure sensors. Most of these components are relatively large in size and weight, and it is not easy to form a flexible large-area and multi-unit array composed of micro-components, and it is not easy to form a "tactile" measurement condition like a finger. [0003] Organic semiconductors, especially small organic molecules, are usually bonded together by...

Claims

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Application Information

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IPC IPC(8): G01L1/18
Inventor 钟高余宋佳刘宇
Owner FUDAN UNIV
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