Unlock instant, AI-driven research and patent intelligence for your innovation.

Methods of forming printed circuit boards having optical function

A printed circuit board, optical functional technology, used in the field of optoelectronics

Active Publication Date: 2010-06-09
ROHM & HAAS ELECTRONICS MATERIALS LLC
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] There is thus a need in the art for a method of forming an optically functional printed circuit board capable of solving this problem related to the situation in the art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Methods of forming printed circuit boards having optical function
  • Methods of forming printed circuit boards having optical function
  • Methods of forming printed circuit boards having optical function

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0054] Four FR4 circuit board substrates are available with 7628 / 1080 fiberglass weave. The surface roughness of each substrate was measured using Dektak from Veken Equipment TM V200-Si stylus profiler to measure. The results of these measurements are shown in Table 1. The substrate was cleaned with acetone and dried with compressed air. Dynamask 40 microns thick using a Morton Thiokol Model 300 heated roll laminator at 230°F (110°C) at 4 ft / min (122 cm / min) and 40 psi (275.8 kPa) TM A 5016 photothermo-curable epoxy acrylic dry film (Eternal Chemical Co., Taiwan) heated roll was laminated on each substrate. At 500mJ / cm on an Olec Accuprint AP-30-800Super Eight exposure unit 2 The dry film layer is exposed to UV radiation. Remove the PET cover sheet for each dry film layer, and the dry film layer for an additional 3000mJ / cm 2 exposure. The coated circuit boards were placed horizontally in a forced air oven at 150°C for one hour. The surface roughness of each coated dry ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Provided are methods of forming printed circuit boards having optical functionality. The methods involve applying a dry-film to a printed circuit board substrate and forming an optical waveguide overthe dry-film. The invention finds particular applicability in the electronics and optoelectronics industries.

Description

[0001] Related Application Cross Reference [0002] This application claims priority under U.S.C. §119(e) to Provisional Application No. 60 / 883,047, filed December 31, 2006, which is incorporated by reference in its entirety. technical field [0003] The present invention generally relates to the field of optoelectronics. In particular, the present invention relates to a method of forming a printed circuit board with optical functions. Background technique [0004] Signal transmission using optical pulse trains is becoming increasingly important in high-speed communications and data transmission. For example, integrated circuits are increasing in importance for high-bandwidth optical interconnect optics. As a result, the integration of optical components such as waveguides, filters, optical interconnects, lenses, diffraction gratings, etc. is becoming increasingly important. [0005] Optical layers incorporated into printed circuit boards (PCBs) in the form of embedded op...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/18G02B6/138
CPCG02B6/138G02B6/136G02B6/1221G02B6/10H05K1/0274G02B6/43G02B6/13
Inventor E·安朱德斯P·D·肯德森
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC