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Structure of fluorescent adhesive paper and producing method thereof

A technology of stickers and manufacturing methods, applied in the structure and manufacturing methods of fluorescent stickers, can solve the problems of difficult replacement, greatly increased cost, and inconvenience, and achieve the goals of increasing convenience and practicality, saving production costs, and reducing costs Effect

Active Publication Date: 2008-10-29
HAYASHIBARA CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the above-mentioned light-emitting diodes can only use a single material or a mix of materials in the manufacturing process, and can emit the desired light color after manufacture. However, if a different color is required, another light-emitting diode of a different material needs to be produced. However, nowadays more and more places or objects require different light colors, and the places and objects cannot often replace the light-emitting diodes to produce different light colors. In addition to being difficult to replace, it is easy to cause a large increase in cost. and cause inconvenience

Method used

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  • Structure of fluorescent adhesive paper and producing method thereof
  • Structure of fluorescent adhesive paper and producing method thereof
  • Structure of fluorescent adhesive paper and producing method thereof

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Embodiment Construction

[0031] Please refer to Figure 1 ~ Figure 2 The structure of the fluorescent sticker 10 of the present invention is composed of a light-transmitting layer 11, a phosphor layer 12, a bottom layer 13 and an adhesive layer 14. The light-transmitting layer 11 is made of resin and is located at the uppermost position, so as to emit light, the phosphor layer 12 is located under the light-transmitting layer 11, wherein the phosphor in the phosphor layer 12 has phosphor powder containing yttrium aluminum garnet or phosphor powder containing terbium aluminum garnet , or the phosphor contains at least one component selected from the group consisting of magnesium tungstate, calcium tungstate, zinc silicate, lanthanum oxyfluoride, and zinc sulfide, or at least one selected from the group consisting of calcium, strontium, Barium, zinc, cadmium, mercury, sulfur, selenium, manganese, copper, silver, europium, and terbium make the light pass through the phosphor layer 12, and the color of the...

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Abstract

The invention provides the structure and the preparation method of a fluorescent sticker. The structure mainly comprises an euphotic layer, a luminous powder layer, a bottom layer and a backing layer; the euphotic layer is positioned at the uppermost layer, so as to emit rays; the luminous powder layer is positioned on the lower side of the euphotic layer, so as to enable the color of the rays to be changed by the luminous powder when the rays pass through the backing layer; the bottom layer is positioned on the lower side of the luminous powder layer; and the backing layer is positioned on the bottom surface of the bottom layer, thereby the color of the rays can be changed by the luminous powder layer, and the attachment is carried out by the backing layer.

Description

technical field [0001] The present invention relates to the structure and manufacturing method of a fluorescent sticker, in particular to a design that can add fluorescent powder into the sticker, so that the color of light can be changed through the fluorescent powder, and the sticker can be attached to a luminous body , such as light bulbs, light-emitting diodes, light-emitting strips, or similar structures that cause light to change the color of light. Background technique [0002] From the early coal lamps to the invention of light bulbs, the human world has been changed. Now, with the development of high technology, a light-emitting diode has been discovered that can gradually replace light bulbs, making many technology companies compete to develop related products. [0003] Today's light-emitting diodes form a bonding interface through P-type semiconductors and N-type semiconductors. When the two layers of semiconductors to be joined belong to the same material, this t...

Claims

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Application Information

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IPC IPC(8): D21H27/22D21H27/28
Inventor 林原
Owner HAYASHIBARA CO LTD