Preparation method of conductive silver composite nano particles coated by polypyrrole

Abstract

The invention discloses a copper-silver composite nano particle and the preparation method thereof. The preparation method includes the steps as follows: weighing a certain amount of chalcanthite solid and dissolving the chalcanthite solid in the solution containing a organic protective agent; holding a specific temperature under the condition of stirring; adding a reducing agent for reaction lasting for 12-24 hours; and slowly adding the silver nitrate solution to the solution for reaction lasting for another 12 hours. The prepared copper-silver composite nano particles encapsulated by polypyrole has good dispersity. The preparation method has the outstanding characteristics that the prepared nano particles is in a homogeneous dispersion, and is encapsulated by the conducting polypyrole on the periphery; the preparation process is comparatively easy and the experimental parameters are easy to control; compared with the single silver powder, the composite nano material has low power, good dispersity, strong stability and feasible industrialized production.

Description

technical field [0001] The invention relates to a method for preparing composite nanoparticles, in particular to a method for preparing copper / silver composite nanoparticles wrapped by conductive polymers, and belongs to the technical field of nanomaterials. Background technique [0002] In recent years, the microelectronics industry has developed rapidly, gradually developing towards miniaturization and high density. The key to realizing the miniaturization and high density of electronic products is the electronic interconnection material. The traditional electronic interconnect material is Sn / Pb solder, but its resolution is low, high temperature heating during soldering is easy to damage components, and lead is a toxic substance that will endanger human health. The use of conductive adhesives to replace traditional tin-lead soldering has become a research hotspot. Compared with the traditional soldering process, the conductive adhesive can be cured at a lower temperatur...

AI Technical Summary

Problems solved by technology

The earliest developed silver-based conductive filler, this type of filler has excellent electrical conductivity and oxidation resistance, but the cost of silver-based conductive filler is high, and it is easy to migrate under hot and humid conditions, which will reduce the conductivity and lead to short circuit.

Copper powder is cheap, has higher anti-migration ability than silver, and has good electrical conductivity, but it is easily oxidized and loses electrical conductivity during the preparation process.

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