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High temperature resistant inorganic adhesive

An inorganic adhesive and high temperature resistant technology, applied in inorganic adhesives, adhesives, etc., can solve the problems of low connection strength and poor heat resistance of bonding metal materials and composite materials, and improve the resistance to ablation and thermal shock. Ability, good heat resistance, simple operation effect

Inactive Publication Date: 2008-11-19
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the defects of poor heat resistance and low connection strength of bonding metal materials and composite materials in existing adhesives, and provides a high temperature resistant inorganic adhesive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0006] Embodiment 1: The high-temperature-resistant inorganic adhesive of this embodiment is composed of an inorganic solvent and a solidified toughening agent according to a mass ratio of 1:0.7 to 1.5; wherein the inorganic solvent is the reaction solution of aluminum phosphate and copper oxide, water glass or aluminum phosphate Solution; the curing and toughening agent is composed of 50 to 95 parts of inorganic curing agent and 5 to 50 parts of toughening and strengthening agent according to parts by weight; the inorganic curing agent is one or more of alumina, zirconia and silicon oxide Combination; the toughening agent is one or a combination of nano-carbon powder, Al-Si alloy powder, Ni powder, boron powder, silicon powder, carbon fiber, quartz fiber, and aluminum silicate fiber.

[0007] In this embodiment, when the inorganic curing agent is composed of two or more substances, they are mixed in any ratio.

[0008] In this embodiment, the particle diameters of alumina, zi...

specific Embodiment approach 2

[0013] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the modulus of water glass is 2-3. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0014] Embodiment 3: The difference between this embodiment and Embodiment 1 is that the mass concentration of the inorganic solvent aluminum phosphate solution is 4% to 5%. Others are the same as in the first embodiment.

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Abstract

The invention provides a high temeperature resistant inorganic cementing compound, relating to an inorganic cementing compound. The invention overcomes the disadvantages that the prior cementing compound has poor heat resistance and low connecting intensity of a glued joint metal material and a composite material. The high temperature resistant inorganic cementing compound consists of an inorganic solvent and a curing toughening agent which are mixed according to a mass ratio of 1 to 0.7-1.5, wherein, the inorganic solvent is a reaction solution of aluminium phosphate and cupric oxide, soluble glass or a aluminium phosphate solution; the curing toughening agent consists of 50 to 95 portions of inorganic solidified agent and 5 to 50 portions of toughening strengthening agent by weight portion. The high temperature resistant inorganic cementing compound has good heat resistance and high connecting intensity of the glued joint metal material and the composite material.

Description

technical field [0001] The invention relates to an inorganic adhesive. Background technique [0002] The existing adhesive has the defects of poor heat resistance and low connection strength for bonding metal materials and non-metallic composite materials. Contents of the invention [0003] The invention aims to solve the defects of poor heat resistance and low connection strength of bonding metal materials and composite materials in existing adhesives, and provides a high-temperature-resistant inorganic adhesive. [0004] The high-temperature-resistant inorganic adhesive of the present invention is composed of an inorganic solvent and a curing toughening agent according to a mass ratio of 1:0.7 to 1.5; wherein the inorganic solvent is the reaction solution of aluminum phosphate and copper oxide, water glass or aluminum phosphate solution; the curing toughening agent According to parts by weight, it is composed of 50-95 parts of inorganic curing agent and 5-50 parts of to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/00
Inventor 冯吉才赵磊张丽霞
Owner HARBIN INST OF TECH
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