Novel wideband microband coupler based on defect place structure

A defect structure and coupler technology, applied in waveguide devices, electrical components, connecting devices, etc., can solve problems such as narrow bandwidth, achieve low resonance frequency, wide operating bandwidth, and improve the effect of coupling mode impedance

Inactive Publication Date: 2008-11-19
INST OF ELECTRONICS CHINESE ACAD OF SCI
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AI-Extracted Technical Summary

Problems solved by technology

[0005] The bandwidth of the traditional single-section λ/4 microstrip directional coupler is relatively narrow, which cannot meet the increasingly higher requirements of the bandwidth in the communication field. In o...
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Abstract

The invention discloses a Broad Band micro-strip coupler based on a defect ground structure. The Broad Band micro-strip coupler comprises a defect ground structure, a microstrip structure signal layer and ports; wherein the defect ground structure comprises a ground layer, an open ring and an interdigital line. The frequencies f0 and f1 of the defect ground structure are determined according to the technical index force factor C, the characteristic impedances Z0 of the terminals, the central frequency fc and the parameter (Epsilon r, h)of the microstrip; f0 is less than fc, and fc is less than f1(as showed in formula I) and the value of f1/f0 is determined according to the requirement of the broad band; the size of the defect ground structure is determined according to f0, f1 and (Epsilon r, h). The width W, the distance and the length p of the coupled microstrip lines are calculated through simulation software and then are optimized to satisfy design requirements. Compared with conventional directional couplers with parallel coupled lines, the Broad Band micro-strip directional coupler added with a defect ground structure which is provided with an open ring and an interdigital line is effectively increased in work bandwidth and the defect ground structure can improve the coupling factor of the coupler.

Application Domain

Coupling devices

Technology Topic

Ground layerSimulation software +10

Image

  • Novel wideband microband coupler based on defect place structure
  • Novel wideband microband coupler based on defect place structure
  • Novel wideband microband coupler based on defect place structure

Examples

  • Experimental program(1)
  • Effect test(1)

Example Embodiment

[0030] Such as figure 1 The structure diagram of a novel broadband coupled microstrip directional coupler based on a defective ground structure is shown as follows: ground layer 1 defective ground structure 4 and microstrip structure signal layer 5; specific examples are as follows:
[0031] In the signal layer 5 with two microstrip structures, there is a gap d between the inner sides of the long sides P of the two signal layers 5 with the microstrip structure. There are two ports 6 at both ends of the signal layer 5 of each microstrip structure.
[0032] The defective ground structure 4 is placed symmetrically at the distance d, and the opening g of the defective ground structure 4 and the distance d of the signal layer 5 of the microstrip structure are overlapped.
[0033] Such as figure 2 A schematic diagram of a defective grounding structure in the shape of an open ring loaded with interdigitated lines. The defective ground structure 4 is composed of a ground layer 1, an open ring 2 and an interdigitated line 3, in which: a ground layer 1 and a microstrip structure signal layer 5 There is a split ring 2 in the middle; a split ring 2 is connected with an interdigital line 3.
[0034] The split ring 2 adopts a rectangular shape; the interdigital lines 3 are cross-connected in the split ring 2.
[0035] An opening g is disposed on the short side a of the split ring 2. The interdigital lines 3 are arranged at equal intervals; the interdigital lines 3 are located at both ends of the long side a of the split ring 2 and are close to the opening g, and are perpendicular to the long side a of the split ring 2.
[0036] The design steps of the novel broadband coupled microstrip directional coupler of the present invention are as follows:
[0037] Step 1: Determine the coupler index: including the coupling coefficient C and the characteristic impedance Z of each port 0 , Center frequency f c , The equivalent dielectric constant of the substrate used in the coupler ε r And thickness h. In this embodiment, choose: C=-10dB, f c =1.4GHz, Z 0 =50Ω,ε r = 2.65, h = 1.5mm.
[0038] Step 2: Determine the basic resonance frequency f of the defective ground structure 4 according to the center frequency and bandwidth of the coupler 0 And the first parasitic resonance frequency f 1 , Making f 0 c 1. Usually make f c = f 0 · f 1 , Choose f according to bandwidth requirements 1 /f 0 Value. In this embodiment, f 0 =0.7GHz, f 1 =2.8GHz.
[0039] Step 3: According to f 0 , F 1 And substrate parameters (ε r , H) Determine the size of the defective ground structure 4, and use electromagnetic simulation software (Ansoft Designer, CST, IE3D, etc.) to simulate and optimize.
[0040] Step 4: Use the following formula to calculate the odd-mode impedance and the coupled-mode impedance Z 0o And Z 0e.
[0041] Z 0 o = Z 0 | 1 - 10 C / 20 | 1 + 10 C / 20 - - - ( 1 )
[0042] Z 0 e = Z 0 1 + 10 C / 20 | 1 - 10 C / 20 | - - - ( 2 )
[0043] Z in this design 0o =36.04Ω, Z 0e = 69.37Ω.
[0044] Step 5: According to the substrate parameters (ε r , H) and the calculated Z 0o And Z 0e , Using simulation software (Ansoft Designer, CST, IE3D, etc.) to calculate the width W and spacing d of the coupled microstrip structure signal layer 5 and the length P of a quarter wavelength, and then optimize the size to meet the requirements of technical indicators.
[0045] Step 6: According to the optimized size of the defective ground structure 4 and the size of the microstrip structure signal layer 5, a processing layout is made and processed.

PUM

PropertyMeasurementUnit
Reflection coefficient<= 15.0dB
Isolation>= 18.0dB

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