Anti-arc protection device and its assembling method

Abstract

An arc protection device and an assembly method thereof are provided. The arc protection device is installed on a wall having at least one first opening of a plasma reaction chamber. The arc protection device comprises a protective board arranged on an inner face of the chamber wall, having a second opening to expose the first opening and part of the inner face of the chamber wall, to form a top pressing part with an edge of the protective board close to the second opening, and an embedded protective piece that covers the part of the inner face of the chamber wall which exposed at the second opening and exposes the first opening, having am embedded part adjacent to the protective board. The embedded part of the embedded protective piece is firmly pressed by the protective board presses with the top pressing part, so that the embedding part is located between the top pressing part and the inner face of the chamber wall, and the surface of the embedded protective piece far away from the inner face of the chamber wall is on the same level of the surface of the protective board far away from the inner face of the chamber wall. The arc protection device is easy to maintain, with low manufacturing cost.

Description

technical field [0001] The invention relates to an anti-arc protection device and an assembly method thereof, in particular to an anti-arc protection device installed on the chamber wall of a plasma reaction chamber and an assembly method thereof. Background technique [0002] With the advancement of modern video technology, liquid crystal displays have been widely used in the display screens of consumer electronic products such as mobile phones, notebook computers, personal computers and personal digital assistants. However, in the semiconductor manufacturing process used in the production of liquid crystal displays, with the demand for high-resolution products, the line width size (Dimension) is getting smaller and smaller, making the aspect ratio of etching (Etch) or gap filling (Gap Filling) ( Aspect Ratio) is getting bigger and bigger. Therefore, no matter in the equipment of dry etching (Dry Etch) or in the equipment of chemical vapor deposition reaction using plasma,...

AI Technical Summary

Problems solved by technology

After the plasma reaction chamber is used for a long time, the insulating film near the opening corner of the chamber wall is more susceptible to erosion than other areas due to the large diffusion space and 270-degree collision angle of plasma atoms or electrons here. If the metal particles caused by the arc fall onto the object to be processed, it will cause pollution of the object to be processed and a decrease in the quality rate, and the production line needs to be stopped for maintenance and replacement from time to time. The insulating film reduces productivity

[0005]On the other hand, when the corners of the chamber wall are damaged, rework must be carried out, which leads to the increase of maintenance costs of the plasma reaction chamber, making the product The cost of production cannot be reduced

Therefore, how to properly design the arc protection device in the plasma reaction chamber, prevent the above-mentioned arc discharge problem in the plasma reaction chamber during the manufacturing process, and solve the shortcomings of difficult maintenance of the plasma reaction chamber Problems to be overcome urgently in machine production technology

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