Processing method for substrate of thin film circuit products
A thin-film circuit and substrate processing technology, which is applied in the field of substrate surface flattening treatment, can solve the problems of high cost and large surface roughness of thin-film substrates, and achieve the effects of avoiding mechanical polishing, excellent quality, and improved miniaturization.
Inactive Publication Date: 2009-01-07
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a method for flattening the surface of the substrate by using the process of coating the surface with high-temperature glass glaze for the disadvantages of high cost and large surface roughness of the film substrate prepared by the prior art. High quality, low cost thin film circuit substrates
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[0034] In this example, Al 2 o 3 The preparation of CaAlSi glass glaze on the substrate is taken as an example to describe the technical solution of the present invention. The specific process for preparing CaAlSi glass glaze can be found in figure 1 .
[0035] Aluminum chloride, calcium nitrate, tetraethyl orthosilicate, glacial acetic acid and absolute ethanol are used as solvents to prepare glass glaze sol, which is hydrolyzed and polymerized into sol, and then coated on the substrate, and then hydrolyzed, polymerized, dried and fixed The temperature of the glaze is sintered to obtain the required glass glaze. In the process of preparing the solution, a certain amount of deionized water should be added to dissolve the aluminum chloride and calcium nitrate, but the water should be removed by heating after the mixed solution is completed, otherwise it may cause the hydrolysis of tetraethyl orthosilicate, resulting in the failure of the solution preparation. And it should ...
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Abstract
The invention relates to a method for manufacturing a film circuit product, in particular to a processing method for flattening the surface of the substrate of the film circuit product. In order to eliminate the defects of the prior art that the cost for preparing the film substrate is high and the surface is rough, the invention discloses a method for flattening the surface of the substrate by adopting the process of coating glass glaze on the surface. The processing method for the substrate comprises the glass glaze preparation process. The processing method is characterized in that the processing method comprises the steps of: 1) preparing collosol containing high temperature glass glaze components; 2) cleaning a ceramic wafer; 3) coating glass glaze collosol uniformly on the substrate; 4) gelating and drying the collosol; 5) sintering at the high temperature. The processing method is used for flattening the surface of the substrate of the film circuit, thus avoiding mechanical polishing which is complicated in process, and significantly reducing the cost. The roughness of the treated surface of the substrate can reach nano-level without micron order defects. The treated substrate is better than a mechanically polished substrate in quality.
Description
technical field [0001] The invention relates to a method for manufacturing a thin film circuit product, in particular to a method for flattening the substrate surface. Background technique [0002] Thin film circuit products, including thin film integrated circuits, thick / thin film hybrid integrated circuits and various thin film passive components (such as thin film resistors, capacitors, inductors, PTC resistors, NTC resistors, varistors, etc.), are passed certain The process deposits thin film materials on the base substrate to form various components and / or electronic circuits (or networks). As a substrate, in addition to selecting physical and chemical indicators and electrical performance indicators that meet the requirements according to the use environment, deposited film material parameters, etc., the surface roughness (RMS) of the substrate is also a very important indicator. [0003] The substrates widely used in the manufacturing process of thin film circuit pro...
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IPC IPC(8): C04B41/86
Inventor 杨传仁杨莉军陈宏伟张继华
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA