Streamline shaped heat radiator for electronic equipment

Abstract

The invention belongs to a streamline electronic equipment radiator, which relates to the technical field of electronic equipment heat dissipation. The streamline electronic equipment radiator comprises a streamline rib and a heat sink block. In order to solve the extreme heat dissipation problem of large power and high thermal-flow density, an integral design concept of fan and radiator is adopted, and the streamline radiator which is consistent to the wind direction of the fan outlet is designed according to the characteristics of the fan; the streamline electronic equipment radiator is characterized in that the surface of the streamline rib is tangent to the fan out-flow speed field vector, conforms the wind direction of the fan outlet, and reduces the flow resistance; the distortion surface effectively enlarges the heat dissipation area, thus improving the convection heat exchange capability; meanwhile, the streamline radiator has the effect of fan static vane guiding and reduces the whole noise.

Description

technical field [0001] The invention relates to a cooling device for electronic equipment with air forced convection, in particular to a radial radiator with streamlined fins. It can be used in the efficient heat dissipation design of radiators for air forced convection cooling systems of power electronics and communication equipment, especially computer CPU radiators. Background technique [0002] At present, the manufacturing technology of electronic components is developing in the direction of lightness, thinness, shortness, and smallness, and the structural design of electronic equipment is also tending to be compact. This trend will cause a sharp increase in thermal load per unit volume. Therefore, it is necessary to configure appropriate cooling devices to Heat removal to maintain the stability and reliability of component operation. [0003] In recent years, many different heat dissipation and cooling technologies have emerged in the electronic heat dissipation indus...

AI Technical Summary

Problems solved by technology

However, for the few manufacturers who have both radiators and fans, they only know how to pursue high air volume fans, but ignore the influence of radiator fin design on fan performance.

On the other hand, the performance defects of the fan may also be compensated to a certain extent by the optimized design of the ribs

Generally, the traditionally designed CPU radiator fins are straight, and the flow field at the fan outlet is not uniform, and there is a certain flow angle. Therefore, when the fluid enters the radiator flow channel of the straight fins, backflow will occur above the fins due to obstruction. Can't get into the bottom of the radiator smoothly to take the heat away

The design of traditional radiators can no longer withstand the severe challenges brought about by high heat flux density. The integrated design of fans and radiators is an inevitable trend in the current extreme design of forced convection heat dissipation.

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