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Process for producing nano-scale W-Cu composite powder with even dispersion

A uniform dispersion and nanoscale technology, which is applied in the field of metal materials, can solve the problems that the composite powder is difficult to achieve uniform dispersion at the nanoscale, and achieve the effects of less equipment investment, simple process control and simple process

Inactive Publication Date: 2009-01-14
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it is still difficult to prepare superfine W-Cu composite powders with dispersed distribution of W and Cu components by mechanically mixing two kinds of metal powders. figure 1 shown), spray drying and other chemical synthesis methods, although ultrafine or even nanoscale W-Cu composite powders can be produced, but because W and Cu still belong to tungsten and copper oxide particles with a certain particle size in the precursor Mechanical mixture, so its composite powder is difficult to achieve uniform dispersion at the nanometer level

Method used

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  • Process for producing nano-scale W-Cu composite powder with even dispersion
  • Process for producing nano-scale W-Cu composite powder with even dispersion
  • Process for producing nano-scale W-Cu composite powder with even dispersion

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] with WO 3 Content of 60g / l (NH 4 ) 2 WO 4 solution with ammoniacal Cu at pH 9 2+ Prepare the solution to obtain the mother liquor; heat the mother liquor to 80°C in a water bath, crystallize to a certain extent with the volatilization of the solvent, and evenly precipitate a precipitate in the mother liquor, filter and clean the obtained precipitate and dry it in a vacuum oven at 80°C to Quality is constant, obtains precursor powder, and X-diffraction analysis result shows (attached image 3 ) precursor is a mixture of copper tungstate and basic copper tungstate; the obtained precursor powder is passed through H at 450°C in a silicon rod reduction furnace 2 Reduce for 1 hour, then pass H at 700°C 2 After reduction for 1 hour, W-Cu composite powder was obtained. The SEM picture (attachment) of gained W-Cu composite powder Figure 4 ) shows that the W-Cu composite powder obtained by the reduction of the precursor powder is fine and uniform, and the particle shape i...

Embodiment 2

[0032] WO 3 Na content of 360g / l 2 WO 4 solution with CuCl at pH 3 2 After the solution is mixed, a precipitate is precipitated. After the obtained precipitate is filtered and cleaned, it is dried in a vacuum drying oven at 80°C until the quality is constant, and the precursor powder is obtained. The precursor powder is first passed through H at 450°C in a silicon rod reduction furnace. 2 Reduce for 1 hour, then pass H at 800°C 2 After reduction for 1 hour, W-Cu composite powder was obtained. The X-diffraction and SEM results of the obtained W-Cu composite powder show that the composite powder has achieved nanometer uniform mixing.

Embodiment 3

[0034] to (NH 4 ) 2 WO 4 、CuSO 4 As a raw material, the WO 3 Measured at 120g / l (NH 4 ) 2 WO 4 solution with Cu at pH 10 2+ The solution is prepared to obtain the mother liquor; the mother liquor is heated to 80°C in a water bath, and after 1 hour of heat preservation, a precipitate is uniformly precipitated in the mother liquor, and the obtained precipitate is filtered and cleaned, and dried in a vacuum drying oven at 80°C until the quality is constant to obtain a precursor powder, the precursor powder is passed through H at 450°C in the silicon rod reduction furnace 2 Reduce for 1 hour, then pass H at 700°C 2 After reduction for 1 hour, nanoscale W-Cu composite powder was obtained.

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Abstract

The present invention discloses a process for preparing the uniformly-dispersed nanometer-level W-Cu compound powder; tungstate and cupric salt solution are respectively prepared firstly; secondly, the wolframate radical ion in the tungstate solution and the copper ion in the cupric salt solution are precipitated in the compound form of tungstenic acid cupric salt by the precipitation or crystallization way, thereby forming the fore-carrier that is combined with W molecule and Cu molecule, and the fore-carrier is reduced to be the nanometer-level W-Cu compound powder. The method of the present invention has simple process, less equipment investment and convenient and simple control, and is applicable to the industrialized production; the produced compound powder can reach the nanometer-level and uniform dispersion.

Description

technical field [0001] The invention belongs to the field of metal materials and relates to a method for preparing uniformly dispersed nano-scale W-Cu composite powder. Background technique [0002] W-Cu composite materials are widely used in electrical contactors, vacuum circuit breakers, In functional and structural devices such as heat sink materials. In these applications, W-Cu materials are often required to have a higher degree of densification and a uniform structure to improve their performance. However, for the W-Cu system where particle rearrangement is the dominant mechanism of sintering densification, since W and Cu are incompatible with each other, and their densities are quite different, it is difficult to obtain a homogenized At the same time, due to the large difference in the melting points of the two components, it is also difficult to achieve a high degree of sintering densification. [0003] Studies have shown that refining the raw material powder and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24
Inventor 李昆李洪桂黄巍李笃信
Owner CENT SOUTH UNIV
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