Rolled copper foil

A technology of rolling copper foil and rolling surface, which is applied in metal rolling, metal rolling, manufacturing tools, etc., can solve the problem of easy deformation of copper foil, and achieve the effect of excellent bending characteristics

Active Publication Date: 2009-01-14
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This is because, if the copper foil is in an annealed (softened) state, when the copper foil is sheared or laminated with a substrate, the copper foil is prone to deformation (such as elongation, wrinkling, bending, etc.), and becomes a defective product.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0045] The rolled copper foil of this embodiment is a rolled copper foil after the final cold rolling process and before recrystallization annealing, and is characterized in that, based on the results obtained by X-ray diffraction polar image measurement based on the rolled surface, When the normalized intensity of the {200} Cu surface diffraction peak of the copper crystal obtained by the β scan of each α angle measured by the polar image is plotted as a graph, the maximum value A of the normalized intensity in the range of α=40-60° and α = The ratio A / B of the maximum value B of the normalized intensity in the range of 80 to 90° is greater than or equal to 4, and, within the range of the above-mentioned α angle being 25 to 45°, when the above-mentioned normalized intensity increases as the α angle increases, There are basically no regions that increase stepwise.

[0046]

[0047] The so-called normalized intensity (Rc) is the averaged count of the specified {hkl} Cu diffra...

no. 2 Embodiment approach

[0064]

[0065] The rolled copper foil in this embodiment is characterized in that, in the state after the final cold rolling step and before recrystallization annealing, the diffraction pattern of the copper crystals is the same as the result obtained from the X-ray diffraction 2θ / θ measurement on the rolled surface. The diffraction intensity of the {220} Cu plane in the peak is strong, and the occupancy rate of the {220} Cu plane is 80% or more.

[0066] figure 2 This is an example of the results of X-ray diffraction 2θ / θ measurement of the rolled surface in the state before the recrystallization annealing after the final cold rolling process in the rolled copper foil of this embodiment. Depend on figure 2 It can be clearly seen that the diffraction intensity of the {220} Cu plane on the rolling surface is very strong, and the occupancy rate of the {220} Cu plane is more than 80%. This indicates that the copper foil is a rolled copper foil having a rolled texture in wh...

no. 3 Embodiment approach

[0076]

[0077] The rolled copper foil in this embodiment is characterized by being a copper alloy containing 0.001 to 0.009% by mass of Sn and the balance being Cu and unavoidable impurities. Next, the reasons for adding alloy components and the reasons for limiting the content of the copper alloy constituting the rolled copper foil in this embodiment will be described.

[0078] For rolled copper foil, the greater the total reduction in the final cold rolling process (for example, 90% or more), the easier room temperature softening tends to occur. If this undesired phenomenon (softening at room temperature) occurs, the deformation of the copper foil will easily occur when the copper foil is sheared or laminated with the substrate during the FPC manufacturing process, which is the main reason for the decrease in the yield.

[0079] By including Sn in Cu, room temperature softening can be suppressed (control of softening temperature or recrystallization start temperature) eve...

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Abstract

Along with development in downsizing, increase in the integration degree (higher density mounting) and higher performance of electronic equipment in recent years, further higher requirement for flexible fatigue property has been increased more and more than usual for the flexible printed circuit. The invention provides a rolled copper foil with more excellent flexible fatigue property, characterized in that: the rolled copper foil obtained after a final cold rolling step but before a recrystallization annealing includes a crystal grain alignment wherein: when normalized intensity of {200}Cu plane diffraction of a copper crystal in results obtained by an X-ray diffraction pole figure measurement with respect to a rolled surface is plotted against at different values of angle [alpha], the normalized intensity being obtained during a [beta] scanning in the pole figure measurement, a ratio of a maximum value A of the normalized intensity with angle [alpha] in a range of 40[deg.] to 60[deg.] to a maximum value B of the normalized intensity with angle [alpha] in a range of 80[deg.] to 90[deg.] is equal to or greater than 4 (A / B>=4); and [0018] when the normalized intensity increases with increasing angle [alpha] in a range of 25[deg.] to 45[deg.], there is essentially no area in which the normalized intensity increases stepwise. It is possible to provide a rolled copper foil having more excellent flexible fatigue property than usual by the recrystallization annealing.

Description

technical field [0001] The present invention relates to a rolled copper foil, and particularly relates to a rolled copper foil suitable for flexible wiring members such as flexible printed circuit boards and having excellent bending properties. Background technique [0002] A flexible printed circuit board (Flexible Printed Circuit Board, hereinafter referred to as FPC) has the advantages of small thickness and excellent flexibility, and has a large degree of freedom of assembly in electronic equipment and the like. Therefore, FPC is now widely used with movable parts such as folding parts of folding mobile phones, digital cameras, and print heads of printers, as well as HDD (Hard Disk Drive) or DVD (Digital Versatile Disc), CD (Compact Disc), etc. Wiring of movable parts of disk-related devices, etc. [0003] As a conductor of FPC, pure copper foil or copper alloy foil (hereinafter, simply referred to as "copper foil") subjected to various surface treatments is generally u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09H05K3/38C22C9/00
CPCB21B38/00B21B38/02B21B1/40Y10T428/12431H05K1/0393B21B2003/005H05K1/09H05K2201/0355
Inventor 室贺岳海伊藤保之青柳幸司山本佳纪横沟健治
Owner JX NIPPON MINING & METALS CORP
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