Outer casing of electronic product and preparation method thereof

A technology for electronic products and shells, which is applied in the field of electronic product shells and their preparation, and can solve the problem that the pattern of the shell does not have a metallic texture.

Inactive Publication Date: 2009-01-28
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the disadvantage that the pattern of the existing electronic product casing does n

Method used

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  • Outer casing of electronic product and preparation method thereof

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Effect test

preparation example Construction

[0012] The preparation method of the electronic product casing provided by the present invention comprises in turn forming a metal coating on the surface of the film layer; forming a printed pattern on the surface of the metal coating; removing the metal coating without a printed pattern on the surface, and then removing the printed pattern; The injection molding layer is formed on the top, so that the metal plating layer is located between the film layer and the injection molding layer.

[0013] The method of forming a metal coating on the surface of the film layer can be an electroplating method, an electroless plating method or a magnetron sputtering ion plating method, because the thickness of the sputtering coating obtained by the magnetron sputtering ion plating method is uniform and compared with the adhesion of the film layer Well, so it is preferred to use the magnetron sputtering ion plating method.

[0014] The magnetron sputtering ion plating method may be an exist...

Embodiment 1

[0033]Using magnetron sputtering ion plating equipment (multi-arc-magnetron sputtering ion coating machine, manufactured by Beijing Beiyi Innovation Vacuum Technology Co., Ltd., model JP-700), the PMMA sheet with a thickness of 0.175 mm is placed on the magnetic On the workpiece rack in the vacuum chamber of the controlled sputtering ion plating equipment, start the vacuum pump to evacuate, and the vacuum degree in the vacuum chamber reaches 4×10 -3 Pa, fill with argon to make the absolute pressure in the vacuum chamber 0.5 Pa, and adjust the temperature in the vacuum chamber to 150°C. Start the DC power supply (voltage is 400 volts, current is 15 volts) that is applied on the magnetron target (the target is 99.99% copper), and under the above-mentioned temperature and pressure conditions, sputter for 3 seconds, and the thickness is 0.175 mm A copper plating layer with a thickness of 10 micrometers was formed on the PC sheet.

[0034] On the screen printing machine, use Shenz...

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Abstract

The invention relates to an electronic product shell, comprising a film layer, an injection layer and a pattern layer which is arranged between the film layer and the injection layer, wherein, the pattern layer is a metal coating. The invention also provides a preparation method of the electronic product shell. The pattern layer of the electronic product shell of the invention is a metal coating which is used for displaying patterns of the electronic product shell, and thereby the patterns of the electronic product shell are metallic. Besides, as the metal coating is arranged between the film layer and the injection layer, the film layer has contact with the outside for protecting the metal coating when used, and the metal coating is not worn.

Description

technical field [0001] The invention relates to an electronic product casing and a preparation method thereof. Background technique [0002] With the wide application and continuous development of electronic products, the appearance of electronic products is also increasingly rich. For example, there are generally patterns on the shell of a mobile phone. Generally, the In Mold Decoration (IMD) method is used to make a patterned shell. The IMD method usually includes printing ink on a film (usually a transparent sheet) according to the required pattern to form a printed pattern layer; The film with the printed pattern layer is molded, die-cut into the desired shape, and then the injection molded layer is formed on the film with the printed pattern layer by the injection molding method, using hard plastic, so as to make a shell with the pattern, and the printed pattern layer is located on the film Between the layer and the injection molded layer, the printed pattern shows thr...

Claims

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Application Information

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IPC IPC(8): B32B27/06B32B15/08B32B38/10C23C14/35B44C1/22G12B9/02
Inventor 黎华挺张家鑫常明珠
Owner BYD CO LTD
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