Inorganic sulfate ion scavenger, inorganic scavenging composition, and electronic component- sealing resin composition, electronic component-sealing material, electronic component, varnish, adhesive,

A technology of sulfate ion and electronic components, which is applied in the field of sulfate ion inorganic capture agent and inorganic capture composition, to achieve the effect of improving reliability

Inactive Publication Date: 2009-01-28
TOAGOSEI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the commercially available compounds contain nitrate ions in the compound, which will release nitrate ions and are restricted in use
In addition, it is also restricted from the viewpoint of easy alloying with copper and recycling

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0206] An inorganic scavenger for sulfate ions, wherein the amount of ionic impurities dissolved in pure water is 500 ppm or less and the amount of sulfate ions is 30 ppm or less, and the sulfate ion exchange capacity is preferably 10 to 0.5 meq / g.

[0207] A kind of hydrotalcite compound, it is in the inorganic scavenger of sulfate ion, and the amount of the ionic impurity that dissolves in pure water is below 500ppm and the amount of sulfate ion is below 30ppm, and sulfate ion exchange capacity is preferably 10 ~0.5meq / g.

[0208] A kind of hydrotalcite burnt product, it is in the inorganic scavenger of sulfate ion, and the amount of the ionic impurity that dissolves in pure water is 500ppm or less and the amount of sulfate ion is 30ppm or less, and sulfate ion exchange capacity is preferably It is 10~0.5meq / g.

[0209] A hydrotalcite compound or hydrotalcite fired product obtained by using a production method utilizing nitrate ion treatment, wherein the amount of ionic impur...

Embodiment 1

[0218] Dissolve 134.6g of magnesium nitrate hexahydrate and 93.8g of aluminum nitrate nonahydrate in 200ml of pure water, keep the solution at 25°C and dissolve 97.4g of sodium carbonate and 160g of sodium hydroxide in 1L of pure water To adjust to pH10.3. Then, aging was carried out at 98° C. for 24 hours. The precipitate after cooling was washed with pure water to obtain hydrotalcite compound 1 (sulfate ion inorganic scavenger A1). When analyzed for this compound, it was Mg 4.5 Al 2 (OH) 13 CO 3 3.5H 2 O.

Embodiment 2

[0220] The hydrotalcite compound 1 prepared in Example 1 was heat-treated at 550° C. for 6 hours. Then, it was pulverized to obtain a fired product of a hydrotalcite compound (sulfate ion inorganic scavenger A2). When analyzed for this compound, it was Mg 4.5 Al 2 o 7.5 .

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Abstract

Disclosed is a novel environmentally friendly, high-performance inorganic sulfate ion scavenger. The inorganic sulfate ion scavenger is characterized in that the amount of ionic impurities to be eluted in purified water is not more than 500 ppm, and the amount of sulfate ions to be eluted in purified water is not more than 30 ppm. Also disclosed are an inorganic scavenging composition containing such an inorganic scavenger, and an electronic component-sealing resin composition, electronic component-sealing material, electronic component, varnish, adhesive, paste and product each using the inorganic sulfate ion scavenger or the inorganic scavenging composition.

Description

technical field [0001] The invention relates to a sulfate ion inorganic capture agent and an inorganic capture composition. Furthermore, the present invention relates to a resin composition for electronic component sealing, an electronic component sealing material, an electronic component, a varnish, an adhesive, a paste, and a product using the same. Background technique [0002] The ion scavenger is blended in resins for sealing electronic components, resins for sealing electrical components, resins for electrical products, and the like. [0003] For example, LSIs, ICs, hybrid ICs, transistors, diodes, and thyristors, or their hybrid components are often sealed with epoxy resin. For these electronic component sealing materials, it is required to suppress defects caused by ionic impurities in raw materials or moisture intruded from the outside, and at the same time require electrical properties such as flame retardancy, high adhesion, crack resistance, and high volume resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J41/10C01F7/00C08K3/22C08K3/26C09J201/00C09K3/10H01L23/29H01L23/31C01F7/441C01F7/785C01F17/218
CPCC01F7/34C01F7/00H01L2924/0002B01J41/10H01L23/293C09K3/10C01F17/0012C01F17/0043C01F7/005C01F7/441C01P2002/22C01F17/30C01F17/218C01F7/785H01L2924/00C08K3/26C08K3/22
Inventor 大野康晴
Owner TOAGOSEI CO LTD
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