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Metal cement diamond tool for preparing ultrathin saw blade diamond tool-bit

A technology of metal bond and diamond cutter head, which is applied in the field of diamond cutter head, can solve the problems of poor sharpness and unstable cutting performance of diamond cutter head, and achieve the effect of good sharpness, stable cutting performance and high precision

Inactive Publication Date: 2009-02-04
泉州众志金刚石工具有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the technical problems of poor sharpness and unstable cutting performance of the existing diamond cutter head matched with the 2.5mm ultra-thin substrate, and to provide a metal bond with excellent performance, which can greatly improve the The sharpness of the diamond cutter head for 2.5mm ultra-thin substrate, and realize the ultra-thin diamond cutter head matching with the 2.5mm ultra-thin substrate

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Embodiment 1: a kind of metal bonding agent that is used to prepare ultra-thin saw blade diamond cutter head, this metal bonding agent is to be formulated by the C of 75% A, 15% B, 10% by mass percentage;

[0016] in:

[0017] A: It is an ultrafine pre-alloyed powder, which is prepared by mass percentage of 76% Cu, 20% Fe, and 4% Co;

[0018] B: It is a phosphorus-containing copper-tin alloy, which is formulated by mass percentage of 91% Cu, 5% Sn, and 4% P;

[0019] C: is an additive, and its atomic percentage is 88% Al, 2% Ce, and 10% Ni.

Embodiment 2

[0020] Embodiment 2: a kind of metal bonding agent that is used to prepare ultra-thin saw blade diamond segment, this metal bonding agent is to be formulated by the C of 80% A, 12% B, 8% by mass percentage;

[0021] in:

[0022] A: It is an ultrafine pre-alloyed powder, which is prepared by mass percentage of 73% Cu, 19% Fe, and 8% Co;

[0023] B: It is a phosphorus-containing copper-tin alloy, which is formulated by mass percentage of 87% Cu, 10% Sn, and 3% P;

[0024] C: is an additive, and its atomic percentage is 88% Al, 2% Ce, and 10% Ni.

Embodiment 3

[0025] Embodiment 3: a kind of metal bonding agent that is used to prepare ultra-thin saw blade diamond segment, this metal bonding agent is to be formulated by the C of 85% A, 9% B, 6% by mass percentage;

[0026] in:

[0027] A: It is an ultrafine pre-alloyed powder, which is prepared by 70% Cu, 18% Fe, and 12% Co by mass percentage;

[0028] B: It is a phosphorus-containing copper-tin alloy, which is formulated by mass percentage of 83% Cu, 15% Sn, and 2% P;

[0029] C: is an additive, and its atomic percentage is 88% Al, 2% Ce, and 10% Ni.

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Abstract

The invention relates to a metal binder for preparing an ultra-thin saw blade diamond knife head and the diamond knife head. The metal binder is prepared by 75-95wp of A, 3-20wp of B and 1-10wp of C; wherein, A is prepared by 50-80wp of Cu, 15-40wp of Fe and 1-20wp of Co; B is prepared by 70-95wp of Cu, 3-25wp of Sn and 0.2-6wp of P; and C is prepared by 88 percent of Al, 2 percent of CE and 10 percent of Ni according to atomic; the metal binder and 30 / 40mesh coarse particle excellent diamonds are mixed according to conventional concentration and sintered to form the ultra-thin saw blade diamond knife head which is matched with a 2.5mm ultra-thin substrate. The diamond knife head has good sharpness, stable cutting performance and high precision of cut boards and eliminates undesirable phenomena of angle board, step-shaped board, ax-shaped board, board with uneven thickness, and the like, thus fully meeting the requirements of the ultra-thin diamond knife head for matching the 2.5mm ultra-thin substrate.

Description

technical field [0001] The invention relates to a diamond segment of an ultra-thin saw blade, in particular to a metal bonding agent for preparing the diamond segment of an ultra-thin saw blade and an ultra-thin diamond saw blade segment made of the metal bonding agent. Background technique [0002] Diamond circular saw blades are widely used in the field of stone processing. In recent years, the domestic stone processing industry has applied ultra-thin diamond saw blade substrate non-equal diameter multi-blade combination saws to the processing of high-quality stone. High-quality stone, especially imported stone, has a high price of blocks. Cutting with ultra-thin saw blades can reduce the width of the kerf and save blocks; the combination of multiple pieces can improve cutting efficiency; the combination of non-equal diameters can improve the processing accuracy of plates, and Reduce saw machine power consumption. Therefore, using this combination saw to process high-qual...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P5/00B22F3/10
Inventor 李伟林方森
Owner 泉州众志金刚石工具有限公司
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