Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Nano leadless soldering paste

A technology of lead-free solder paste and lead-free solder, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of lead poisoning and achieve the effect of lowering the temperature

Inactive Publication Date: 2009-02-11
SHANGHAI UNIV
View PDF0 Cites 26 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, lead is a toxic metal, and the human body absorbs low doses of lead to cause lead poisoning

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Nano leadless soldering paste
  • Nano leadless soldering paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] The nano-lead-free solder paste of the present embodiment is made up of Sn-Ag-Cu nano-lead-free solder powder and rosin no-cleaning flux, with a total weight of 10g, and its composition is calculated by mass fraction as:

[0017] Nano lead-free solder powder 90 parts

[0018] Flux 10 parts

[0019] The mass percent of each element in the nanometer lead-free solder powder is:

[0020] Ag 4.0%;

[0021] Cu 0.5%;

[0022] Sn margin.

[0023] a. The nanopowder stored in the paraffin liquid is separated, and chloroform is selected as the separation solvent.

[0024] b. Mix the separated nano-powder and rosin no-cleaning flux evenly to make solder paste, and its melting point is lowered as shown in figure 1 .

Embodiment 2

[0026] The nano-lead-free solder paste of the present embodiment is made up of Sn-Co-Cu nano-lead-free solder powder and rosin no-clean flux, with a total weight of 10g, and its composition is calculated by weight fraction:

[0027] Nano lead-free solder powder 90 parts

[0028] Flux 10 parts

[0029] The mass percent of each element in the nanometer lead-free solder powder is:

[0030] Cu 0.7%;

[0031] Co 0.4%

[0032] Sn margin.

[0033] The nanometer powder stored in the paraffin liquid is separated, and chloroform is selected as the separation solvent. Mix the separated nano-powder with rosin no-cleaning flux evenly to make a solder paste, and its melting point is lowered as shown in figure 2 . Example 3

Embodiment 3

[0034] The nano-lead-free solder paste of the present embodiment is made up of Sn-Bi nano-lead-free solder powder and rosin no-clean flux, with a total weight of 10g, and its composition is calculated by weight fraction:

[0035] Nano lead-free solder powder 90 parts

[0036] Flux 10 parts

[0037] The mass percent of each element in the nanometer lead-free solder powder is:

[0038] Bi 57%

[0039] Sn margin.

[0040] The nanometer powder stored in the paraffin liquid is separated, and chloroform is selected as the separation solvent. The separated nano-powder is evenly mixed with rosin no-cleaning flux to prepare a solder paste.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Sizeaaaaaaaaaa
Login to View More

Abstract

The invention relates to nano lead-free soldering paste used for electronic element welding and surface packaging. The nano lead-free soldering paste consists of nano lead-free solder powder and soldering flux, and according to the mass percent, the nano lead-free soldering paste contains the following components: 85 to 94 percent of nano lead-free solder powder and 6 to 15 percent of soldering flux, wherein, the nano lead-free solder powder can be Sn-Ag, Sn-Ag-Cu, Sn-Bi, Sn-Zn, Sn-Zn-Bi, Sn-Co-Cu, Sn-Cu, Sn-In, or Sn-Sb. The nano lead-free soldering paste has all the basic properties of common lead-free soldering paste, and the melting point thereof is reduced. Compared with the common lead-free soldering paste, the nano lead-free soldering paste does not contain the toxic element of lead, thereby being applicable to the electronic packaging technology in the microelectronic industry.

Description

technical field [0001] The invention relates to a lead-free solder paste used for soldering and surface packaging of electronic components, in particular to a nano-lead-free solder paste. Background technique [0002] Soldering is a very old and practical technology, mainly based on tin-lead alloy system, the eutectic temperature of this tin-lead alloy is 183 ℃, it has good physical properties, mechanical properties and metallurgical properties, so it is widely used in the electronics industry. The use of tin-lead eutectic solder alloy has a long history, and a lot of practical application experience has been accumulated in production. At the same time, the cost of raw materials is low and the resources are extensive. However, lead is a toxic metal, and low doses of lead absorbed by the human body can cause lead poisoning. With the increase of electronic waste, a large number of waste electronic devices are discarded or buried, and the toxic component lead in electronic wa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B23K35/22
Inventor 刘建影张利利陈思张燕翟启杰高玉来
Owner SHANGHAI UNIV
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com