Laser cutting method based on inner carving

A laser cutting and laser technology, applied in the field of laser processing and laser cutting of "transparent" hard and brittle materials, can solve the problems of expensive system, low efficiency, glass or sapphire thickness can not be too thick, etc., to achieve smooth section and cutting efficiency. high effect

Active Publication Date: 2009-03-18
INNO LASER TECH CORP LTD +1
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  • Claims
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Problems solved by technology

The disadvantages of this method are obvious: the thickness of glass or sapphire cannot be t...

Method used

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  • Laser cutting method based on inner carving
  • Laser cutting method based on inner carving
  • Laser cutting method based on inner carving

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Embodiment Construction

[0015] See figure 1 As shown, this is an embodiment of a laser cutting method based on internal engraving of the present invention. The material to be cut is colorless and transparent sapphire, which is almost transparent to ultraviolet light. It is a hard and brittle material, and it is difficult to cut efficiently by traditional methods. A 355nm UV Q-switched solid-state laser is used, with an average power of 4 watts at a pulse repetition frequency of 30KHz, a pulse width of 9ns, and single-mode. Among them, 1 is the surface to be cut, and 2 is the Gaussian ultraviolet beam, which is focused on the surface to be cut of the material to be cut, and its focal spot has a certain depth of focus, and its length is between 6 and 7. Since the laser peak power density exceeds the destruction threshold of sapphire, each laser pulse creates a detonation point at the laser focus inside the sapphire. When the laser focus moves horizontally in the cutting surface, a "cutting line" 3 is ...

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Abstract

The invention pertains to the filed of laser processing and discloses a laser cutting method based on internal carving. The key feature of the invention is that laser penetrates through cutting material and focuses on the interior of the cutting material to be cut, and then the bottom of the cutting material to be cut is processed in a layered and bottom-up manner to obtain a cutting section in a'micro explosion' way, thereby cutting transparent and translucent crisp and hard materials with high efficiency and high quality.

Description

[0001] FIELD OF THE INVENTION The present invention is in the field of laser processing, in particular laser cutting of "transparent" hard and brittle materials. Background technique [0002] For the cutting of hard and brittle materials, laser cutting generally has advantages, such as speed, yield, and quality are all improved a lot. However, if this kind of material which is difficult to cut by conventional processing means is transparent to the laser, or absorbs very little, the traditional laser cutting is powerless, or the cutting efficiency is extremely low. For example, quartz glass, sapphire and other materials are generally cut by ultraviolet or even deep ultraviolet lasers. The laser focus cuts out a very shallow groove after one scan on the surface of the glass or sapphire. After multiple scans, the groove depth will be deepened until cut off. The disadvantages of this method are obvious: the thickness of glass or sapphire cannot be too thick (limited by the laser ...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/40B23K26/08C03B33/09B23K26/402
CPCY02P40/57
Inventor 张立国
Owner INNO LASER TECH CORP LTD
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