Immersion self-adapting seal control device used for photo-etching machine

A self-adaptive sealing and control device technology, applied in the direction of photolithography exposure device, microlithography exposure equipment, etc., can solve the problems of filling flow field pressure fluctuations, increasing liquid leakage, interference force, etc., to achieve flow field High stability, avoid air bubble entrainment, reduce the effect of internal power

Inactive Publication Date: 2009-04-08
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] (1) Due to the use of positive pressure liquid supply and negative pressure recovery, the pressures of the two are not easy to coordinate, and it is easy to cause pressure fluctuations and interference forces in the filling flow field, and lead to turbulent flow in the liquid and some undesirable and unpredictable effects
[0007] (2) The positive pressure liquid supply method makes the liquid inside the gap flow field have a higher pressure, and this force acts on the sealing structure, which increases the possibility of liquid leakage and affects the reliability of the seal.
[0008] (3) When the substrate is moving at a high speed, due...

Method used

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  • Immersion self-adapting seal control device used for photo-etching machine
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  • Immersion self-adapting seal control device used for photo-etching machine

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Embodiment Construction

[0040] The present invention will be further described below in conjunction with drawings and embodiments.

[0041] Such as figure 1 As shown, it shows the assembly of the immersion adaptive sealing control device and the projection lens group according to the embodiment of the present invention. The device can be applied in step-and-repeat or step-and-scan lithography equipment. During the exposure process, the light emitted from the light source (not shown in the figure) (such as: ArF or F2 excimer laser) passes through the aligned mask plate (not shown in the figure), the projection lens group 1 and the immersion liquid The lens-substrate gap field exposes the photoresist on the surface of the substrate 3 .

[0042] Such as Figure 1 to Figure 5 It schematically shows the immersion adaptive sealing control device of the embodiment of the present invention, which is composed of a sealing member 2A and an adaptive sealing member 2B, wherein:

[0043] 1) Sealing member 2A: ...

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Abstract

The invention discloses an immersion self-adaptive sealing control device used in a lithography machine. The immersion self-adaptive sealing control device is arranged between a projection lens set and a substrate, and consists of a sealing element and a self-adaptive sealing member. When liquid forms the impact on the self-adaptive sealing member due to traction of the substrate, the device can absorb the impact formed by the high-speed moving liquid and converts the impact into power enhancing sealing; on the contrary, when the substrate draws the liquid away from the self-adaptive sealing member, the liquid prestored inside the device follows to enter a slit flow field to avoid gas bubble entrainment owing to the loss of the liquid at the boundary, meanwhile, the reduction of the liquid prestored inside the device reduces the sealing power of the self-adaptive sealing member, and the leaked liquid flows back to the inside of the slit flow field along with the substrate due to the reduction of obstruction. The liquid transmission mode of the immersion self-adaptive sealing control device adopts negative pressure recovery and free flow of a fluid injection end, which avoids the flow field fluctuation caused by the in-coordination between the injected fluid and the recovery pressure.

Description

technical field [0001] The invention relates to a liquid supply and recovery sealing device in an immersion lithography (Immersion Lithography) system, in particular to an immersion self-adaptive sealing control device for a lithography machine. Background technique [0002] Modern lithography equipment is based on optical lithography, which uses an optical system to accurately project and expose the pattern on the mask onto a substrate (such as a silicon wafer) coated with photoresist. It includes a laser light source, an optical system, a projection mask composed of chip patterns, an alignment system and a substrate covered with photosensitive photoresist. [0003] The immersion lithography system fills a certain liquid in the gap between the projection lens and the substrate, and increases the numerical aperture (NA) of the projection lens by increasing the refractive index (n) of the medium in the gap, thereby improving the resolution of lithography rate and depth of fo...

Claims

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Application Information

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IPC IPC(8): G03F7/20
Inventor 付新陈晖陈文昱杨华勇
Owner ZHEJIANG UNIV
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