Electronic component and method for manufacturing the same

Abstract

There are provided an electronic component in which two substrates are bonded to each other with a large bonding force and a method for manufacturing electronic components in which two substrates can be bonded to each other with a large bonding force and in which the substrates are not likely to be bent and broken. In an embodiment, a plurality of first connection portions 30 is formed on a first substrate 22, and in addition, a plurality of IDT electrodes 26 and a plurality of second connection portions 32 are formed on a second substrate 24. The first connection portions 30 are engaged in concave parts of the second connection portions 32, so that temporary bonding is performed. Between adjacent first connection portions 30, only the first substrate is cut. By heat application, laser irradiation, pressure application, ultrasonic application, or the like, the first connection portions 30 and the second connection portions 32 are finally bonded to each other. The second substrate 24 is cut along the cut portions of the first substrate 22, so that a plurality of electronic components 20 is formed.

Description

technical field [0001] The present invention relates to an electronic component and its manufacturing method, and more particularly, to a chip-shaped electronic component sandwiched between two substrates and its manufacturing method. Background technique [0002] Figure 10 It is a schematic diagram showing the bonding method of two board|substrates used for a conventional electronic component. A first aluminum (Al) film 2 is formed on a first pyrex (registered trademark) glass substrate 1 . In addition, a second aluminum film 4 is formed on a second Pyrex (registered trademark) glass substrate 3 . On the first aluminum film 2 is formed a planar circular and non-tapered concave groove 5 , and on the second aluminum film 4 is formed a planar circular and tapered convex tooth 6 with a tapered front end. These concave grooves 5 are meshed with convex teeth 6, and a compressive load is applied at room temperature, whereby the first substrate 1 and the second substrate 2 are j...

AI Technical Summary

Problems solved by technology

[0006] However, in the bonding structure disclosed in Patent Document 1, since two substrates are bonded by friction of the aluminum film caused by compression at room temperature, there is a problem of weak bonding force.

Therefore, when forming a chip by forming an element on a large substrate, bonding two substrates, cutting and chipping, there is a possibility that the bonded part may come off due to an impact during chip formation.

In addition, in the case where the element is sealed by such a junction, there is a possibility that cutting water may infiltrate into the element when the junction is cut off for chip formation.

In addition, in the case of the surface acoustic wave device of Patent Document 2, since the bonding is performed between the anode bonding portion and the main surface of the cover substrate, a force that generates a parallel offset between the two substrates is generated. In other words, the bonding force between two substrates is weak

In addition, when performing anodic bonding, since the entire substrate needs to be heated to 300°C or higher, if there is a difference in the coefficient of linear expansion between the two substrates, the generation of residual stress cannot be avoided when returning from the bonding temperature to room temperature.

Therefore, warpage or breakage of the bonded substrate occurs

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