Member for mounting semiconductor element, semiconductor device, and imaging equipment
A semiconductor and component technology, which is applied in the field of ceramic assembly substrates, can solve problems such as poor connection between electrode layers and conductive layers, uneven film thickness, and weak adhesion of metal layers, so as to reduce peeling and uneven film thickness, and increase the area Quantity, effect of improving reliability
Inactive Publication Date: 2009-04-22
ALLIED MATERIAL
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Problems solved by technology
[0012]However, since the through-hole formed by laser processing is formed in a conical shape whose diameter gradually decreases from the incident side of the laser beam to the exiting side, the On the surface on the laser emission side, the surface intersects the inner surface of the through hole at an acute angle, and the adhesion of the metal layer formed by physical vapor deposition, printing, plating, etc. is weak due to the corner portion intersecting at an acute angle, And it is easy to form uneven film thickness, so when the electrode layer and conductive layer are formed on the insulating member, there is a problem that poor connection between the electrode layer and the conductive layer is likely to occur.
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[0079] figure 1 It is a partially enlarged plan view of an aggregate substrate 1 serving as a base of an imaging element mounting insulating member 2 as an example of an embodiment of the aggregate substrate 1 of the present invention. and, figure 2 is an enlarged cross-sectional view of a portion of the through-hole 11 in the collective substrate 1, image 3 It is an enlarged cross-sectional view of the through-hole 11 in the insulating member 2 obtained by dicing the collective substrate 1 . and, Figure 4 is a plan view showing the main surface 21 side of the insulating member 2, Figure 5 It is a plan view showing the semiconductor element mounting part BL formed by joining the frame body 4 on the main surface 21, Figure 6 It is a bottom view showing the external connection surface 22 side of the insulating member 2 . and, Figure 7 It is an imaging device formed by mounting an imaging element PE1 as a semiconductor element on the element mounting region 21a on the...
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A collective substrate has through-holes. The through-holes each have an interior surface including taper surfaces which are tapered as having an opening size progressively decreasing from a main surface and an external connection surface toward a minimum size hole portion. A semiconductor element mount includes an insulative member cut out of the collective substrate. An imaging device includes an imaging element mounted in a region surrounded by a frame which is bonded to the main surface of the insulative member and closed by a cover. A light emitting diode component includes a light emitting element mounted on the main surface of the insulative member with the minimum size hole portion of the through-hole being filled with an electrically conductive material, the light emitting element being sealed with a fluorescent material and / or a protective resin. The LED embarks the light emitting element in the encapsulation.
Description
[0001] The present invention is an invention filed by the applicant United Materials Corporation on September 12, 2006 with the application number 2005800080325 and the title of the invention is "Assembly substrate, semiconductor element mounting component, semiconductor device and imaging device, light emitting diode component, light emitting diode" Divisional application of the application. technical field [0002] The present invention relates to a composite substrate made of ceramics in which a plurality of plate-shaped insulating members are integrally formed in a shape arranged on the same plane; a semiconductor element mounting component formed using insulating members obtained by cutting the composite substrate for each region; An imaging device formed of the semiconductor element mounting member, a semiconductor device such as a light emitting diode component, and a light emitting diode formed using the light emitting diode component. Background technique [0003] I...
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IPC IPC(8): H01L23/498H01L33/00H01L27/146H01L31/0203
CPCH01L2924/12041H01L24/97H01L2224/48091H01L2224/48227
Inventor 桧垣贤次郎高木大辅石津定筑木保志
Owner ALLIED MATERIAL