Omnidirectional ion injection and deposition batch composite handling arrangement and method
A technology of ion implantation and compound treatment, which is applied in the direction of ion implantation plating, coating, metal material coating process, etc., can solve the problems of no significant improvement in wear resistance and corrosion resistance and low efficiency, and achieve improvement and resistance Corrosion ability, wide range of application fields, effect of improving efficiency
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specific Embodiment approach 1
[0006] Specific implementation manner one: such as Figure 1~3 As shown, the omnidirectional ion implantation and deposition batch composite processing device described in this embodiment consists of a vacuum chamber body I, two sets of pulsed cathode arc sources II, two sets of magnetron sputtering targets III, a radio frequency interface assembly IV, and a central rotation The target stage system V is composed of the vacuum chamber body I consisting of a cylinder body 1, a cylinder upper end cover 2 and a cylinder lower end cover 3. The cylinder upper end cover 2 and the cylinder lower end cover 3 are respectively connected to the cylinder body 1 The upper and lower end surfaces of the two sets of pulsed cathode arc sources II are arranged symmetrically along the axis of the cylindrical body 1 on the outer side wall of the cylindrical body 1 and communicate with the cylindrical body 1. The two sets of magnetron sputtering The target III is symmetrically arranged on the outer side...
specific Embodiment approach 2
[0007] Specific implementation manner two: such as image 3 As shown, the number of the plurality of gear shafts 5 and the plurality of gears 7 in this embodiment is twenty-four. Several gear shafts 5 and several gears 7 are used to ensure a single batch processing of the surface of mechanical parts. Other components and connection relationships are the same as in the first embodiment.
specific Embodiment approach 3
[0008] Specific implementation manner three: such as figure 1 , figure 2 As shown, the workpiece rotating device (4), two sets of pulsed cathode arc sources (II) and two sets of magnetron sputtering targets (III) in this embodiment are arranged on the same horizontal plane. Ensure the axial uniformity of the strengthening layer on the surface of the mechanical parts. Other components and connection relationships are the same as in the first embodiment.
[0009] Specific implementation manner 4: such as image 3 As shown, the central rotating target stage system V of this embodiment further includes a shaft sleeve 15. The lower end surface of the shaft sleeve 15 is fixedly mounted on the upper end surface of the cylindrical lower end cover 3, and the shaft sleeve 15 is sleeved on the rotation shaft. On 14, the stability of the rotation shaft 14 is enhanced. Other components and connection relationships are the same as in the first embodiment.
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