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Copper plating solution composition

A copper plating solution and copper plating technology, applied in the field of copper plating solution, can solve the problems of losing plate folding and flexibility, limiting the thickness of the conductive circuit layer, and the impossibility of obtaining a copper plating layer, etc., to achieve excellent appearance, uniform precipitation, The effect of smooth surfaces

Active Publication Date: 2012-08-29
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in recent years, when using materials such as polyimide resin to manufacture flexible printed wiring boards, the thickness of the conductive circuit layer formed on the board has been limited due to fear of losing the foldability and flexibility of the board.
However, generally, when a thicker layer of about 20 μm obtained using the prior art is deposited, it is impossible to obtain a copper-plated layer with excellent appearance and physical properties
That is to say, when the thickness of the copper plating layer is greater than about 20 μm, there will be differences in the roughness of the base metal layer surface and the size of the deposited copper plating particles on the surface of the copper plating film, making it difficult to obtain uniform and high-quality gloss copper coating

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] The following compounds were added to deionized water to prepare a pretreatment liquid solution.

[0060] Table 1

[0061] Copper sulfate pentahydrate 75g / l (copper is 19.1g / l)

[0062] Sulfuric acid 190g / l

[0063] Hydrogen chloride 51.4mg / l (chloride compound ion is 50mg / l)

[0064] Sodium bromide 2.58mg / l (bromide compound ion is 2mg / l)

[0065] Bis-(3-sulfopropyl)-disodium disulfide 4mg / l

[0066] Polyoxyethylene polyoxypropylene glycol monobutylene

[0067] Base ether (weight average molecular weight 1100) 1.5g / l

[0068] Deionized water balance

[0069] pH 1>

[0070] The rolling (roll) copper foil to be plated is used as the negative electrode, and the positive electrode that can be dissolved in the solution containing copper phosphate (copper phosphorus), is electroplated in the above-mentioned copper plating bath, and the electroplating conditions are that the solution temperature is 25 ° C, the current density 2ASD, deposi...

Embodiment 2

[0073] A copper plating film (8 μm) was deposited using a copper plating solution in the same manner as in Example 1 except that 1.5 g / l polyethylene glycol #12000 (weight average molecular weight 12000) was used instead of polyoxyethylene polyoxypropylene glycol.

[0074] The obtained copper plating film has a uniform and flat surface, exhibits a specular luster on the outside, and is free of dimpled pits.

Embodiment 3

[0076] A copper plating solution was prepared as follows: 75 mg / l of imidazole and diethylene glycol and epichlorohydrin and the reaction product disclosed in Unexamined Patent Application No. 2004-250777 were added to the copper plating solution of Example 1. A copper plating film (8 µm) was deposited using a copper plating solution in the same manner as in Example 1.

[0077]The obtained copper plating film has a uniform and flat surface, exhibits a specular luster on the outside, and is free of dimpled pits.

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Abstract

To provide a copper plating solution composition that precipitates copper plated membranes that are both uniform and smooth and which has good external appearance even if the copper plated membranes that are formed are relatively thin. The copper plating solution composition contains chlorine ions and bromide ions in specific volumes.

Description

technical field [0001] The present invention mainly relates to a copper plating solution. To give more detail, the present invention relates to an acidic copper electroplating solution and a method of forming a copper plating film using the same, for example suitable for forming a copper plating film up to a thickness of about 20 μm. Background technique [0002] Electrolytic copper plating has a variety of applications in industry. For example, it is also used as a decorative coating and anti-corrosion film. In addition, it is also used in the electronics industry to manufacture printed circuit boards and semiconductors. During the manufacture of circuit boards, copper plating can be used to form a wiring layer on the surface of the circuit board and a conductive layer for passing through the walls of the vias between the surfaces of the printed circuit board. [0003] In electroplating methods for forming metal films on items such as copper-clad laminates, printed wirin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 林慎二郎泷口久范
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC