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Low tin-zinc base leadless metal spraying solder

A technology based on lead-free gold-spraying and tin-zinc, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of high cost, lead poisoning, etc., achieve low cost, low price, improve wetting sexual effect

Inactive Publication Date: 2009-05-27
丁飞
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Overcome the defect of high cost of lead-free gold-sprayed solder, and the bad phenomenon that lead-sprayed gold solder is easy to lead to lead poisoning

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Raw materials: (Kg) Sn 1, Al 0.8, Si 0.1, Cu 0.2, Sb 0.08, Pd 0.04, Nd 0.005, Zn 97

[0026] Preparation:

[0027] (1) Weigh various raw materials by weight percentage, put the weighed Sn into a graphite crucible, heat and melt.

[0028] (2) Mix lithium chloride and potassium chloride with a weight ratio of 1:1 as a covering agent to completely cover the molten Sn liquid surface with a thickness of 3 mm, so that the Sn liquid surface is isolated from oxygen in the air.

[0029] (3) When the temperature of the Sn solution is raised to 850°C, add Al, Si, Cu, Sb, Pd, Nd in sequence, and stir with a dry wooden stick for each metal added. To speed up the melting, stop heating after it is completely melted, and after standing for 25 minutes, remove the mixed covering agent, and the ingot is SnAlSiCuSbPdNd multi-element master alloy

[0030] (4), Zn is placed in another graphite crucible, after adding the above-mentioned covering agent, heat to make Zn melt, and when its tem...

Embodiment 2

[0033] Raw materials: (Kg) Sn 10, Al 4, Si 0.4, Cu 0.8, Sb 1, Pd 0.3, Nd 0.01, Zn 83

[0034] Preparation:

[0035] (1), take various raw materials by weight, and put the Sn that has been weighed into the container, heat and melt;

[0036] (2), mix lithium chloride and potassium chloride with a weight ratio of 1:1 as a covering agent, and cover the molten Sn liquid surface, so that the Sn liquid surface is isolated from oxygen in the air;

[0037] (3) When the temperature of the Sn solution is raised to 900° C., Al, Si, Cu, Sb, Pd, and Nd are added in sequence, and stirred while heating. To speed up the melting, stop heating after it is completely melted, and after standing for 30 minutes, remove the mixed covering agent, and the ingot is the SnAlSiCuSbPdNd multi-element master alloy;

[0038](4) Put Zn in another container, add the above-mentioned covering agent, heat to melt Zn, and add the multi-element master alloy prepared in (3) when the temperature rises to 600°C, sti...

Embodiment 3

[0041] Raw materials: (Kg) Sn 7, Al 2, Si 0.2, Cu 1, Sb 1.1, Pd 0.4, Nd 0.001, Zn 88

[0042] Preparation:

[0043] (1), take various raw materials by weight, and put the Sn that has been weighed into the container, heat and melt;

[0044] (2), lithium chloride and potassium chloride with a weight ratio of 1: 1 are mixed as a covering agent, covered on the molten Sn liquid surface, so that the Sn liquid surface is isolated from oxygen in the air;

[0045] (3) When the temperature of the Sn solution is raised to 950° C., Al, Si, Cu, Sb, Pd, and Nd are added in sequence, and stirred while heating. To accelerate the melting, stop heating after all the melting, and after standing for 35 minutes, remove the mixed covering agent, and the ingot is the SnAlSiCuSbPdNd multi-element master alloy;

[0046] (4) Put Zn in another container, add the above-mentioned covering agent, heat to melt Zn, and add the multi-element master alloy prepared in (3) when the temperature rises to 650°C, ...

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Abstract

The invention relates to a low-tin-zinc-base lead-free metal spraying solder. The solder alloy comprises the following components by parts by weight: 1-10 parts of Sn, 0.1-4 parts of Al, 0.01-0.5 part of Si, 0.1-1 parts of Cu, 0.08-1.2 parts of Sb, 0.01-0.5 part of Pd, 0.001-0.01 part of Nd and 82-98 parts of Zn. The metal spraying solder of the invention has strong oxidation resistance in high temperature, excellent wetting property, reliable welding and better conductivity and mechanical property than lead-base metal spraying solder. Main performance indexes and application effect of the solder completely reach and surpass level of existing lead-free metal spraying solder, thereby overcoming the high-cost defect of lead-free metal spraying solder; the solder also avoids lead poisoning caused by leaded metal spraying solder.

Description

technical field [0001] The invention relates to a low-tin-zinc-based lead-free gold-sprayed solder, in particular to a low-tin-zinc-based lead-free gold-sprayed solder suitable for spraying the end faces of metallized polyester film capacitors in electrical discrete devices, belonging to electronic process materials and electronic Preparation technology field. Background technique [0002] Lead-based gold-sprayed solder has long been used as a conductive material sprayed on the end of film capacitors. Because of its many excellent properties, it once occupied a dominant position in the electronics industry. However, lead is toxic. When waste electronic appliances are disposed of in landfills, the solder in the solder When lead encounters acid rain or groundwater, it forms lead-containing salts, which are easily soluble in groundwater, enter the human water supply chain, and enter the human body. Over time, it will lead to lead poisoning. After poisoning, lead is not easy to ...

Claims

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Application Information

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IPC IPC(8): B23K35/28C22C1/03
Inventor 丁飞
Owner 丁飞
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