Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and device for high-efficiency recovery of waste circuit boards in vacuum

A technology of discarded circuit boards and vacuum conditions, applied in recycling technology, electronic waste recycling, solid waste removal, etc., can solve the problems of easy pollution of the environment, high energy consumption, high energy consumption and environmental pollution, and achieve good safety , low energy consumption, easy to filter and separate the effect

Inactive Publication Date: 2009-06-03
CENT SOUTH UNIV
View PDF7 Cites 32 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These two types of equipment rely on shearing, impact and centrifugation to crush waste circuit boards. Although the crushing efficiency has been improved, they still have the disadvantages of high energy consumption and easy environmental pollution.
[0014] The above method separates and recycles the waste circuit board components, and the recycling process has the disadvantages of high energy consumption and easy pollution of the environment.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for high-efficiency recovery of waste circuit boards in vacuum
  • Method and device for high-efficiency recovery of waste circuit boards in vacuum
  • Method and device for high-efficiency recovery of waste circuit boards in vacuum

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] 1 Put 32.00g of waste printed circuit boards with electronic components to be processed into the drum of the vacuum pyrolysis and centrifugal compound machine, and connect the pipeline on the upper part of the vacuum container with the cold trap, alkaline drying tube, vacuum pump, and alkaline solution in sequence The filter tank and the gas collector are connected.

[0058] 2. Turn on the cooling water and the vacuum pump to make the system in a vacuum state.

[0059] 3. Select the final temperature of pyrolysis as 500°C, and heat up the vacuum container program. After the solder is melted, when the system temperature is 300°C, start the motor at a speed of 600rpm and rotate for 5 minutes; when the system temperature is 500°C, rotate for 5 minutes; recycle the solder ; The final temperature holding time is 20 minutes, the volatile products of the cracked gas will automatically enter the cold trap for cooling, set the temperature of the cold trap to -20°C, most of them ...

Embodiment 2

[0066] 1. Put 31.98g of waste printed circuit boards with electronic components to be processed into the drum of the vacuum pyrolysis and centrifugal compound machine, and connect the pipeline on the upper part of the vacuum container with the cold trap, alkaline drying tube, vacuum pump, alkaline The solution filter tank and the gas collector are connected.

[0067] 2. Turn on the cooling water and the vacuum pump to make the system in a vacuum state.

[0068] 3. Select the final temperature of pyrolysis as 550°C, and heat up the vacuum container program. After the solder is melted, when the system temperature is 300°C, start the motor and rotate at a speed of 800rpm for 5 minutes; when the system temperature is 550°C, rotate for 5 minutes; recycle the solder ; The final temperature holding time is 30 minutes, the volatile products of the cracked gas automatically enter the cold trap for cooling, set the temperature of the cold trap to -30°C, most of them are liquefied into l...

Embodiment 3

[0075] 1. Put 32.30g of waste printed circuit boards with electronic components to be processed into the drum of the vacuum pyrolysis and centrifugal compound machine, and connect the pipeline on the upper part of the vacuum container with the cold trap, alkaline drying tube, vacuum pump, alkaline The solution filter tank and the gas collector are connected.

[0076] 2. Turn on the cooling water and the vacuum pump to make the system in a vacuum state.

[0077] 3. Select the final temperature of pyrolysis as 600°C, and heat up the vacuum container program. After the solder is melted, when the system temperature is 300°C, start the motor and rotate at a speed of 1000rpm for 5 minutes; when the system temperature is 600°C, rotate for 5 minutes; recycle the solder ; The final temperature holding time is 40 minutes, the volatile products of the cracked gas automatically enter the cold trap for cooling, set the temperature of the cold trap to -40°C, most of them are liquefied into ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method and a device for high-efficiency recovery of waste circuit boards in vacuum. The method comprises the following steps: the waste circuit board is arranged in a vacuum vessel and heated for pyrolysis, wherein, most of pyrolysis volatile matter is cooled and liquefied into liquid oil, and the rest is taken into a gas collector; a centrifuge device separates soldering tin from the circuit board during the pyrolysis; substrates and electronic components of the pyrolyzed circuit board are assorted and collected to be further separated and recovered. The device comprises a compound vacuum pyrolysis and centrifuge device, a cold trap, the gas collector and a vacuum pump. The vacuum vessel of the compound vacuum pyrolysis and centrifuge device is sequentially connected with the cold trap, the vacuum pump and the gas collector by pipelines. The device has the advantages of simple process, no pollution, low cost, high efficiency, and high recovery ratio of waste resources of the waste circuit boards. The soldering tin and organic substances of the waste circuit boards are synchronously recovered, and the soldering tin is separated from other metals at a high efficiency, thus creating a good condition for high-efficiency recovery of other metals. The method and the device are suitable for industrialized application and can help achieve large-scale recovery of the waste circuit boards.

Description

Technical field: [0001] The invention relates to a method and a device for efficiently recovering waste circuit boards under vacuum conditions, and belongs to the technical field of resource recovery and reuse of waste electronic and electrical products. Background technique [0002] The present invention is a recycling process researched and developed for a large number of waste printed circuit boards (printed circuit board, PCB). With the rapid development of the economy and electronic information industry, the replacement of electronic and electrical products is accelerating, and the service life of products is shortened, resulting in a large number of electronic products being discarded. Waste printed circuit boards are an important part of electronic waste, and its clean recycling has become a global problem that needs to be solved urgently. Discarded circuit boards are different from general solid waste. In addition to precious metals and other valuable metals, they a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B09B3/00
CPCY02W30/82
Inventor 丘克强周益辉
Owner CENT SOUTH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com