Solvent composition for manufacturing stacked capacitor

A technology of solvent composition and laminated capacitors, which is applied to the parts of fixed capacitors, fixed capacitor dielectrics, inorganic insulators, etc., can solve the problem of not being able to stably inhibit sheet erosion, effectively preventing sheet erosion, mixing ratio or Purity changes and other issues, to achieve the effect of inhibiting and preventing sheet erosion, low toxicity, and stable quality

Inactive Publication Date: 2009-06-24
DAICEL CHEM IND LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the mixing ratio or purity may vary depending on the place of production, etc.
In addition, there are two types of isomers in the above-mentioned terpineol hydrogenation product, and due to the difference in quality of raw materials, it may be difficult to stably suppress the chip erosion phenomenon.
In addition, when solvents such as ethyl caproate and 2-ethylhexyl acetate are used, the temperature of the solvent also rises due to the temperature rise in the drying step, and the solubility of the adhesive components contained in the green sheet increases, so there is no effective To prevent sheet erosion and other problems
[0009] In addition, if a mixed solvent based on the standard of not dissolving only the binder resin is used, there are cases where the balance between the boiling point of the solvent and the heating temperature at the drying step of the multilayer capacitor becomes poor, and it takes time in the drying step

Method used

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  • Solvent composition for manufacturing stacked capacitor
  • Solvent composition for manufacturing stacked capacitor
  • Solvent composition for manufacturing stacked capacitor

Examples

Experimental program
Comparison scheme
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Embodiment 1～15

[0046] (Examples 1-15, Comparative Examples 1-10)

[0047] Glyceryl triacetate (DRA-150, manufactured by Daicel Chemical Co., Ltd.) and solvent A were mixed according to the ratios described in Tables 1 to 5 below to prepare a solvent composition. The solvent composition was divided into three parts, and an acrylic resin (trade name "Elvacite (Elvacite) 2045" manufactured by DuPont) was added to the first part of the solvent composition, and a polyacrylate resin was added to the second part of the solvent composition. Vinyl butyral resin (trade name "S-REC (エスレック) BL" manufactured by Sekisui Chemical Co., Ltd.), ethyl cellulose (trade name "ETHOCEL STD (エトセルSTD)" was added to the third solvent composition Dow Chemical Co., Ltd.), each resin concentration was 5% by weight, heated and dissolved at a liquid temperature of 65° C. for 3 hours, and then left to cool.

[0048] (evaluate)

[0049] The solubility of each resin to each solvent composition was visually observed for the...

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Abstract

The invention provides a solvent composition for producing a stacked capacitor which has good adhesivity with a raw film, does not consume time during a dry step, and is not easy to generate an etching phenomenon. The solvent composition for producing the stacked capacitor contains a 60-95 wt% 0f the glyceryl triacetate, preferably the solvent composition contains a 5-40 wt% 0f at least one of substance selected from cycloalkyl ester acetate, dialkylene glycol alkyl ether, dialkylene glycol monoalkyl ether acetate, alkyl ether acetate, alkylene glycol aryl ether and terpinol.

Description

technical field [0001] The present invention relates to a solvent composition for producing a multilayer capacitor which is less likely to cause chip attack (Site Attack) during the production of a multilayer capacitor (multilayer capacitor). Background technique [0002] A multilayer capacitor is generally manufactured through the following steps. First, polyvinyl butyral or acrylic resin binder resin is dissolved in an organic solvent, and ceramics are added and mixed. Furthermore, this mixture was formed into a sheet form to obtain a green sheet. [0003] Next, a dielectric paste mainly composed of a conductive metal material such as nickel and palladium, and an organic solvent such as ethyl cellulose and terpineol is coated on the green sheet by screen printing or the like to form wiring. [0004] Furthermore, the solvent in the above-mentioned dielectric paste is dried, and the green sheet on which the wiring is formed is cut to a certain size, and a plurality of plat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12
CPCC04B35/6264H01B3/12H01G4/12
Inventor 堀口明赤井泰之肥后彻佐佐木晃
Owner DAICEL CHEM IND LTD
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