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Photosensitive, aqueous alkaline solution-soluble polyimide resin and photosensitive resin composition containing the same

A technology of polyimide resin and alkali aqueous solution, which is applied in the field of photosensitive resin composition, and can solve problems such as inability to bend excessively, insufficient flexibility, etc.

Inactive Publication Date: 2009-06-24
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, when the cured product of the solder resist composition disclosed in Patent Document 1 is used, although the crack resistance of the surface is improved, the flexibility is still insufficient, and there is a problem that excessive bending cannot be performed.

Method used

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  • Photosensitive, aqueous alkaline solution-soluble polyimide resin and photosensitive resin composition containing the same
  • Photosensitive, aqueous alkaline solution-soluble polyimide resin and photosensitive resin composition containing the same
  • Photosensitive, aqueous alkaline solution-soluble polyimide resin and photosensitive resin composition containing the same

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Embodiment

[0120] Hereinafter, the present invention will be described in more detail through examples, but the present invention is not limited to the following examples.

Synthetic example 1

[0122] Synthetic polyimide resin (a-1)

[0123] After nitrogen purging was carried out in the 3L flask with stirring device, reflux pipe, water trap (water trap) and thermometer, add gamma-butyrolactone 1052.3g, PMDA (pyromellitic anhydride, Degussa company manufacture) as solvent , molecular weight 218.1) 87.3 g, ODPA (3,3'4,4'-diphenyl ether tetracarboxylic dianhydride, manufactured by MANAC, molecular weight 310.2) 279.2 g, 3,4'-diaminodiphenyl ether (Mitsui Chemical Co., Ltd., molecular weight 200.2) 200.2g, γ-valerolactone 13.0g, pyridine 20.6g, and toluene 20g as a catalyst, reacted at 180°C for 8 hours, while removing the water generated by the reaction, the dehydrating agent toluene, and the catalyst, While stirring, a resin solution containing 35% of polyimide resin was obtained (this solution is referred to as (a-1)). The weight average molecular weight is 17700.

Synthetic example 2

[0125] Synthetic polyimide resin (a-2)

[0126] After purging nitrogen in the 5L flask with stirring device, reflux pipe, water trap and thermometer, add gamma-butyrolactone 1741.4g, DSDA (3,3'4,4'-diphenylsulfone Tetracarboxylic dianhydride, manufactured by Nippon Chemical Co., Ltd., molecular weight 358.28) 358.3 g, BY16-853U (polysiloxane diamine, manufactured by Toray Dow Corning Co., Ltd., molecular weight 926) 370.4 g, ADPE (3,3 '-Diamino-4,4'-dihydroxydiphenyl ether, manufactured by Nippon Kayaku Co., Ltd., molecular weight 232.24) 209.0 g, γ-valerolactone 10.0 g as a catalyst, pyridine 15.8 g, toluene 20 g, at 180 The mixture was reacted at °C for 8 hours and stirred while removing generated water, dehydrating agent toluene, and catalyst to obtain a resin solution containing 35% of polyimide resin (this solution is referred to as (a-2)). The weight average molecular weight is 23200.

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Abstract

Disclosed is a photosensitive, aqueous alkaline solution-soluble polyimide resin (A) obtained by reacting a polyimide resin (a), which is obtained by reacting tetracarboxylic acid dianhydride with a diamine compound, with an energy ray-curable, aqueous alkaline solution-soluble resin (b). By blending this photosensitive, aqueous alkaline solution-soluble polyimide resin (A) with a photopolymerization initiator or the like, there is obtained a photosensitive resin composition excellent in photosensitivity. This photosensitive resin composition enables to obtained a cured product excellent in flexibility, low warping property, adhesion, solvent resistance, acid resistance, heat resistance, gold plating resistance and the like.

Description

technical field [0001] The present invention relates to a photosensitive alkaline aqueous solution-soluble polyimide resin capable of developing in an alkaline aqueous solution, a photosensitive resin composition using the resin, and a cured product of the resin. More specifically, the present invention relates to providing a solder mask and coverlay for flexible printed wiring boards, an interlayer insulating film for multilayer printed wiring boards, etc., and having developability, flexibility, A cured photosensitive resin composition and cured product thereof excellent in adhesiveness, heat resistance, chemical resistance, plating resistance, etc. Background technique [0002] At present, in the solder resist film of some civilian printed circuit boards and most industrial printed circuit boards, from the viewpoint of high precision and high density, after exposure by photolithography (photolithography), an image is formed by development, and then A photocurable resin c...

Claims

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Application Information

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IPC IPC(8): C08G81/00C08F290/00G03F7/023G03F7/027G03F7/038
CPCC08G73/1025C08G73/101C08G73/1021G03F7/0233G03F7/0387H05K3/287C08G59/182Y10T428/24802C08F290/00C08G73/10C08G81/00G03F7/038
Inventor 田中龙太朗内田诚
Owner NIPPON KAYAKU CO LTD
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