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Multilayer printed wiring board, solder resist composition, method for manufacturing multilayer printed wiring board, and semiconductor device

A multi-layer printing and circuit board technology, which is applied in the direction of multi-layer circuit manufacturing, printed circuit secondary treatment, non-metallic protective layer coating, etc., can solve the problem that multi-layer printed circuit boards are difficult to meet the flame retardancy and other problems

Inactive Publication Date: 2009-07-08
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0023] However, it is difficult for a multilayer printed circuit board containing a solder resist made of a conventional solder resist formulation to meet the flame retardancy

Method used

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  • Multilayer printed wiring board, solder resist composition, method for manufacturing multilayer printed wiring board, and semiconductor device
  • Multilayer printed wiring board, solder resist composition, method for manufacturing multilayer printed wiring board, and semiconductor device
  • Multilayer printed wiring board, solder resist composition, method for manufacturing multilayer printed wiring board, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0378] A. Preparation of resin formulation for upper roughened surface structure

[0379] (i) 25% acrylated cresol novolac acrylate novolac epoxy resin (produced by Nippon Kayaku, molecular weight 2,500) dissolved in diglyme (DMDG) with 35 parts by weight of 80 wt% concentration ) produced resin solution, 3.15 parts by weight of photosensitive monomer (produced by Toagosei Chemical Company, Aronix M315), 0.5 parts by weight of defoamer (produced by SanNopco Company, S-65), and 3.6 parts by weight of N Methylpyrrolidone (NMP) was placed in a container to mix and stir to make a blended formulation.

[0380] (ii) 12 parts by weight of polysulfone (PSF), 7.2 parts by weight of epoxy resin particles (produced by Sanyo Chemical Co., Polymerpol) with an average particle size of 0.1 μm, and 3.09 parts by weight of epoxy resin particles with an average particle size of 0.5 μm Epoxy resin particles were put into another container and mixed and stirred into a mixture, then 30 parts by w...

example 2

[0437] A. The preparation of the resin formulation for the roughened surface structure of the upper and lower layers and the preparation of the resin filler were carried out in the same manner as discussed in Example 1.

[0438] B. Methods for Manufacturing Multilayer Printed Circuit Boards

[0439] (1) A copper-laminated laminate is used as a raw material, which consists of a substrate 1 made of 1mm-thick glass epoxy resin or BT (bismaleimide triazine) resin and layers on both sides of the substrate 1 Composed of copper foil 8 with a thickness of 18 μm (refer to Image 6 (a)). Firstly, holes are drilled on the copper laminate to form through holes, and electroless plating is performed, followed by pattern etching to form the lower layer conductive circuit 14 and plated through holes 9 on both sides of the substrate 1 .

[0440] (2) Clean and dry the synthetic substrate that has been made into the plated through hole 9 and the lower layer conductive circuit 14 with water, th...

example 3

[0482] Adopt the same method of Example 1 to manufacture a multilayer printed circuit board, except adding 7 parts by weight of epoxy-terminated polybutadiene as an elastomer in the process of solder mask formulation preparation in step (16).

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PUM

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Abstract

The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.

Description

[0001] This application is the international application number PCT / JP 00 / 05044, the international application date is July 28, 2000, and the application number entering the Chinese national phase is 00814075.8, entitled "Multi-layer printed circuit board, solder resist formula, multi-layer A divisional application of the invention patent application of "Manufacturing method of printed circuit board and semiconductor device". technical field [0002] The invention relates to a multilayer printed circuit board, a manufacturing method of the multilayer printed circuit board, a solder resist formula and a semiconductor device. Background technique [0003] The multi-layer printed circuit board of the so-called multi-layer combined circuit board is made by a semi-additive method or a similar method. It adopts the method of interlacing conductive circuits such as copper and interlayer resin insulation layers on the resin substrate. Among them, the resin substrate is reinforced wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28H05K3/46
Inventor 钟晖岛田宪一丰田幸彦浅井元雄王东冬关根浩司小野嘉隆
Owner IBIDEN CO LTD
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