High-power LED aluminum substrate integrated module

Abstract

The invention discloses an LED street lamp, aiming at providing a high power LED aluminum base plate integrated module with excellent heat elimination performance and effectively prolonged service life. The high power LED aluminum base plate integrated module comprises an LED (1) and an aluminum base plate (2). The aluminum base plate (2) comprises an aluminum plate (20); an insulated oxidizationlayer (25) is covered on the upper surface of the aluminum plate (20); a basement film (21) and a conducting film (22) are arranged on the insulated oxidization layer (25) in sequence; the conductingfilm (22) forms a circuitous pattern; the basement film (21) is matched with the contour of the conducting film (22); a plurality of welding films (23) are arranged on the conducting film (22); the chip of the LED (1) is stuck to the insulated oxidization layer (25); and a lead foot of the LED (1) is welded on the welding film (23). The LED street lamp can be widely applied to the lighting field.

Description

technical field [0001] The invention relates to a high-power LED aluminum substrate integrated module. Background technique [0002] The development of the electronic industry is changing with each passing day, electronic technologies emerge in an endless stream, and electronic components are becoming increasingly sophisticated. At present, high-power LEDs are developing rapidly. The luminous efficiency of LEDs is already in the leading position of various light sources, but the heat generation per unit volume is rising step by step, which will seriously affect the performance, life and reliability of LEDs. Therefore, there is an urgent need for a low-cost, high-heat dissipation LED application packaging technology that can meet the international environmental protection trend. [0003] There is an existing LED aluminum substrate, such as figure 1 As shown, the single LED 1 and the aluminum substrate 2 are welded and fixed. Due to the difference in materials, the heat cond...

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Problems solved by technology

[0003] There is an existing LED aluminum substrate, such as figure 1 As shown, the single LED 1 and the aluminum substrate 2 are welded and fixed. Due to the difference in materials, the heat conduction at the welding part is greatly affected. The heat conduction from the diode to the aluminum substrate is slow, and the heat generated by the diode cannot be dissipated quickly; The heat dissipation area of ​​the diode is small and the contact area with the heat sink is small, and the heat transfer is slow. Therefore, the heat dissipation effect of the aluminum substrate of the diode is not ideal, and it is easy to cause the diode to accelerate aging due to overheating and shorten the service life of the diode.

When the product requires two or more LEDs, if still use such as figure 1 For the single diode shown, fasten two or more single diodes on the heat sink, so that due to various reasons, the contact area between each diode and the heat sink is different, and the speed of heat transfer is not balanced. It will appear that the service life of individual diodes is significantly lower than that of other diodes, resulting in the overall performance and service life of the product

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