Micro electro mechanical system (MEMS) process-based micro atomic cavity device air tightness package and method

Abstract

The invention relates to a micro electro mechanical system (MEMS) manufacturing process-based micro atomic cavity air tightness package structure and a method. The structure and the method are characterized in that: a micro atomic cavity which is manufactured by the MEMS process is arranged in a glass or metal seal buffer cavity through a supporting structure, and the air tightness of the micro atomic cavity is improved, so that the service life of devices such as a micro atomic clock and the like based on the micro atomic cavity is prolonged, and the stability of the devices is improved. The structure and the method have a key point that: in the glass or metal buffer cavity structure, the inside of the buffer cavity is vacuumized or filled with buffer gas of which the components and the pressure are approximate to those of gas in the micro atomic cavity, and a leading wire of the micro atomic cavity passes through the buffer cavity to realize air tightness lead. By the package structure and the method, the leakage rate of the micro atomic cavity and outside can be effectively reduced, and the technical problem of short service life of micro atomic cavity devices is solved. The air tightness package structure is particularly suitable for the micro atomic cavity devices such as micro atomic clocks, micro atom magnetometers, micro atom gyroscopes and the like with low power consumption and small volumes.

Description

technical field [0001] The invention relates to an airtight packaging structure and method of a miniature atomic cavity device based on MEMS technology, and belongs to the field of micro-electromechanical system (MEMS) device manufacturing and packaging, and the field of atomic physics devices. Background technique [0002] The development of micro-electro-mechanical systems (MEMS) technology has produced a series of micro-processing technology, which has fundamentally changed the manufacture of miniaturized devices, and the types of miniaturized devices that can be manufactured have been greatly expanded. The integrated manufacturing of technologies such as optics, fluid, chemistry, and biology can realize chip-level microsystems and various miniaturized devices or microsystems. These miniaturized devices have the characteristics of small size and low power consumption. At the same time, the MEMS batch manufacturing process can make the manufacturing cost lower, and the MEM...

AI Technical Summary

Problems solved by technology

It is a necessary condition for the normal operation of the gas cavity of the miniature atomic clock to ensure that there is no air leakage. If the micro atomic cavity has a very small gas leakage, because the cavity volume is only a few cubic millimeters, the anaerobic sealing environment inside the cavity will be damaged, and the alkali metal Oxidation of atomic vapor will cause the atomic clock to fail, shortening the life of the miniature atomic clock

At the same time, a very small air leak will cause a large change in the composition of the internal buffer gas, and the frequency stability of the miniature atomic clock will drift, resulting in a decrease in performance

For miniature atomic clocks, due to the small size of their miniature atomic cavities, the leakage rate of miniature atomic clocks with practical value needs to be lower than 10 -13 atm.cc.s -1 This is a great technical challenge for the miniature atomic cavity manufactured by the MEMS silicon-glass anodic bonding process

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