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Etching liquid and cuprum wiring forming method by using the same

An etching solution and wiring technology, applied in the field of etching solution, can solve the problem of insufficient undercut inhibition force, and achieve the effect of excellent linearity

Active Publication Date: 2013-01-02
MEC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the etching solutions and etching methods described in Patent Documents 1 to 6 are insufficient in undercut suppression, and therefore, an etching solution and an etching method with high undercut suppression are urgently desired in the market.

Method used

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  • Etching liquid and cuprum wiring forming method by using the same
  • Etching liquid and cuprum wiring forming method by using the same
  • Etching liquid and cuprum wiring forming method by using the same

Examples

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Embodiment

[0057] Hereinafter, examples and comparative examples of the etching solution of the present invention will be described. It should be noted that the explanation of the present invention is not limited to the following examples.

[0058] Each etchant having the composition shown in Table 1 was prepared, etched under the conditions described below, and each item was evaluated by the evaluation method described below. Each etching solution was prepared by first dissolving hydrochloric acid in ion-exchanged water, and then adding the remaining components. It should be noted that the concentration of hydrochloric acid shown in Table 1 is the concentration in terms of hydrogen chloride. In addition, the numerical values ​​in parentheses of the polymer contained in each etching solution shown in Table 1 represent values ​​measured under the condition that the sample concentration is 5% by weight (solvent: toluene) using a vapor pressure type molecular weight measuring device manufa...

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Abstract

The present invention relates to etching liquid cuprum wiring forming method by using the same. the present invention provides etching liquid capable of forming cuprum wiring with few undercut and few pit and excellent rectilinearity, and cuprum wiring forming method by using the etching liquid. The etching liquid is cupreous etching liquid containing acid, cupric ion source, tetrazole and water,containing polymer possessing the followed formula (I) functional group in the composition unit.

Description

technical field [0001] The present invention relates to a copper etching solution containing an acid, a copper ion source, tetrazoles, and water, and a method for forming copper wiring using the etching solution. Background technique [0002] In the production of printed wiring boards, when forming copper wiring patterns by photolithography, ferric chloride-based etchant, copper chloride-based etchant, alkaline etchant, etc. are used as etchant. When these etchant are used, the copper under the anti-corrosion coating called undercut may dissolve from the side surface of the wiring pattern. That is, there occurs a phenomenon in which a portion (that is, a wiring portion) that is not intended to be etched away due to being covered with an anti-corrosion coating is removed by side etching, and the width of the wiring becomes narrower from the bottom to the top of the wiring. (undercut). Especially when the wiring pattern is fine, it is necessary to have as few undercuts as po...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06C23F1/18
Inventor 户田健次出口政史高久修司宋春红
Owner MEC CO LTD
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